CryoCMOS Design Director, Quantum - Austin, Texas, United States of America

Originally posted 28 October 2026 by the employer.

Lead the development of cryogenic CMOS ICs and quantum-control electronics from architecture to silicon characterization.

About the role

The CryoCMOS Design Director will lead a multidisciplinary team of approximately 10–20 analog, RF, digital, mixed-signal, and physical design engineers developing cryogenic CMOS ICs and reusable design solutions. The role oversees the complete IC development lifecycle, delivering integrated circuit solutions for quantum and other advanced applications.

What you'll do

- Lead a multidisciplinary engineering team across analog, RF, digital, mixed-signal, and physical design, establishing technical direction, resource plans, and execution strategy. - Direct end-to-end development of CryoCMOS ICs and reusable design IP, covering architecture, simulation, physical implementation, verification, tapeout, silicon bring-up, and characterization. - Provide technical leadership on architecture reviews, design methodologies, performance optimization, design closure, risk mitigation, and resolution of critical design issues. - Partner with PDK, compact modeling, technology development, test, packaging, and design enablement teams to translate foundry capabilities into manufacturable IC solutions. - Establish and refine IC design processes, review mechanisms, quality standards, and execution metrics to support predictable tapeouts. - Collaborate with internal stakeholders, customers, and ecosystem partners to translate system requirements into design roadmaps and development programs.

What you'll need

- Bachelor's degree in Electrical Engineering, Computer Engineering, Microelectronics, Applied Physics, or a related technical field. - Minimum 10 years of relevant semiconductor IC design experience with progressively increasing technical leadership responsibilities. - Demonstrated experience leading and managing IC design teams spanning analog, mixed-signal, RF, digital, or physical design. - Proven track record leading complex IC development through architecture, design, verification, physical implementation, tapeout, silicon bring-up, and design-to-silicon correlation. - Strong understanding of CMOS IC design, semiconductor devices, design methodologies, PVT variation, parasitic effects, and silicon characterization.

Nice to have

- Master's degree or PhD in Electrical Engineering, Microelectronics, Computer Engineering, Applied Physics, or a related field. - Experience leading IC design organizations of 10 or more engineers. - Experience with cryoCMOS, quantum-control/readout electronics, or low-temperature electronics. - Deep technical expertise in analog/mixed-signal, RFIC, digital IC, or high-speed circuit design. - Experience working with semiconductor technology development, PDK, compact modeling, EDA, test, packaging, and silicon characterization teams. - Experience establishing or scaling an IC design capability, including design flows, reusable IP, and tapeout execution practices.

Skills: CryoCMOS, IC design, tapeout, analog, mixed-signal, quantum