Career Accelerator Program - Packaging Engineer - Dallas, TX, United States
Originally posted 11 September 2026 by the employer — open 9 days.
About the role
This role involves participating in the Career Accelerator Program (CAP) to gain professional and technical training, accelerating ramp into Texas Instruments, and setting up for long-term career success. You will interface across various work areas to design, develop, and analyze semiconductor packaging technologies for analog and embedded processing products.
What you'll do
- Partner with businesses to design and develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip, Modules, SIPs, and other advanced packages.
- Participate in cross-functional teams, supporting product qualification and production, and helping to meet reliability, yield requirements, design testability, and test coverage.
- Direct design-of-experiments and work with material suppliers to downselect innovative packaging materials to enhance the reliability and performance of advanced packages.
- Conduct electrical, mechanical, and thermal models to comprehend silicon-to-package interaction, establish design rules, and predict and prevent high-risk designs.
What you'll need
- Bachelors degree in Material Science, Mechanical Engineering, Chemical Engineering, Physics, Electrical Engineering or related.
- Cumulative 3.0/4.0 GPA or higher.
Nice to have
- Basic understanding of statistical process control (SPC).
- Semiconductor packaging knowledge (manufacturing processes, assembly, reliability, materials, characterization, FA).
This role has been open 8 days — well below the 54-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
299
|
Median days open
54 d
|
Median salary
$179k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Texas Instruments | All employers we track in this specialty (299 roles · 58 employers) |
|---|---|---|
| Open roles in this specialty | 4 | 299 |
| Open roles in the wider Process, Fab & Equipment family | 211 | 9314 · 108 employers |
| Median days open | 13 d | 54 d (−41 d vs this employer) |
| Median salary (USD postings) | — | $179k |
Who's hiring in this category
- KLA Corporation · 49 open roles · median 101 d
- Micron Technology · 36 open roles · median 28 d
- Renesas Electronics · 21 open roles · median 20 d
- Infineon Technologies · 18 open roles · median 40 d
- Intel Corporation · 13 open roles · median 75 d
- Lumilens · 13 open roles · median 44 d
How we counted: 299 open Packaging Engineering (Advanced Packaging) roles from 58 employers tracked in the SemiconductorJobs index, counted 20 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.