CAD Engineer - Manila, Alabang, Philippines
About the role
This role involves providing CAD support for semiconductor package drafting, including bond shell, build diagrams, and 3D models for Navitas products.
What you'll do
- Create and maintain directories for bond shell and build diagrams.
- Prepare bond shell for new package developments.
- Create 3D models for thermal and thermomechanical simulations.
- Prepare 3D models for Preliminary and Final Datasheets.
- Create and maintain directories for Package Outline Drawings (POD).
- Align package dimensioning requirements with acceptable tolerances of a semiconductor component.
What you'll need
- Bachelor's degree in Engineering or a related technical field.
- At least 5 years experience in semiconductor package drafting support.
- Ability to apply GDT (Geometric dimensioning and tolerancing) in applicable drawings.
Nice to have
- Advanced 2D/3D CAD skills (AutoCAD, Solidworks).
- Familiarity with semiconductor package design rules.
Skills: bond shell, build diagrams, 3D model, package outline drawing, semiconductor package drafting, AutoCAD
This role has been open 33 days — well below the 65-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
201
|
Median days open
65 d
|
Median salary
$162k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Navitas Semiconductor | All employers we track in this specialty (201 roles · 42 employers) |
|---|---|---|
| Open roles in this specialty | 3 | 201 |
| Open roles in the wider Process, Fab & Equipment family | 8 | 9348 · 109 employers |
| Median days open | 33 d | 65 d (−32 d vs this employer) |
| Median salary (USD postings) | — | $162k |
Skills observed across this category: bond shell, build diagrams, 3D model, package outline drawing, semiconductor package drafting, AutoCAD
Who's hiring in this category
- Infineon Technologies · 29 open roles · median 27 d
- Micron Technology · 21 open roles · median 138 d
- Renesas Electronics · 19 open roles · median 20 d
- Intel Corporation · 12 open roles · median 144 d
- Monolithic Power Systems · 12 open roles · median 180 d
- onsemi · 7 open roles · median 60 d
How we counted: 201 open Packaging Engineering (Packaging) roles from 42 employers tracked in the SemiconductorJobs index, counted 16 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.