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NXP Semiconductors

BGA WB Process Engineer - Kuala Lumpur, Malaysia

NXP Semiconductors Kuala Lumpur, Malaysia 1 month ago
Packaging & Advanced Integration

Originally posted 2 September 2026 by the employer.

About the role

This role involves driving yield improvement for BGA devices and managing WB LOH alignment to NXP goals.

What you'll do

  • Drive yield improvement for assigned BGA devices.
  • Align WB LOH with NXP goals and customer delivery timelines.
  • Collaborate with the NPI team to establish new products, including WB recipe creation and verification for BGA packages.
  • Support productivity initiatives and cost savings efforts.

What you'll need

  • Bachelor's or Master's degree in Electronics or Mechanical Engineering.
  • Knowledge of FMEA, control plan, SPC, DOE, and process flow.
  • Willingness to learn the WB process with hands-on machine experience.

Skills: WB process, FMEA, control plan, SPC, DOE

Market context

This role has been open 22 days — well below the 70-day median for Packaging Engineering roles.

Packaging Engineering · Packaging

Open roles in category
198
Median days open
70 d
Median salary
$167k
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
How NXP Semiconductors compares in Packaging Engineering hiring
Metric NXP Semiconductors All employers we track in this specialty (198 roles · 42 employers)
Open roles in this specialty 5 198
Open roles in the wider Process, Fab & Equipment family 120 9525 · 109 employers
Median days open 22 d 70 d (−48 d vs this employer)
Median salary (USD postings) — $167k

Skills observed across this category: WB process, FMEA, control plan, SPC, DOE

Who's hiring in this category

  • Infineon Technologies · 29 open roles · median 35 d
  • Renesas Electronics · 20 open roles · median 27 d
  • Micron Technology · 18 open roles · median 146 d
  • Monolithic Power Systems · 12 open roles · median 188 d
  • Intel Corporation · 11 open roles · median 153 d
  • onsemi · 8 open roles · median 51 d

How we counted: 198 open Packaging Engineering (Packaging) roles from 42 employers tracked in the SemiconductorJobs index, counted 24 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.

Apply now
Kuala Lumpur, Malaysia
On-site
1 month ago

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