AutoTEM technician - Oregon, Hillsboro, United States
$63,090 - $89,060 USD yearly
Originally posted 18 September 2026 by the employer — open 0 days.
About the role
This role involves supporting Intel's technology development efforts by preparing ultra-thin specimens and performing Transmission Electron Microscopy (TEM) analysis. Your work will directly contribute to process development, product qualification, and failure analysis.
What you'll do
- Perform technical functions to support engineering activities like fabrication, process integration, and failure analysis.
- Conduct detailed engineering tasks and technical procedures to prepare samples or capture imaging using advanced FIB and TEM tools.
- Complete work in alignment with general instructions and priorities while exercising judgment in resolving non-standard problems.
- Maintain necessary records and reports for lab activities and ensure adherence to established protocols.
- Continuously upgrade skills through hands-on training and collaboration with peers.
- Participate in lab sustaining efforts, ensuring the availability and maintenance of analytical tools and processes.
What you'll need
- Bachelor's degree in a technical field such as Electrical, Mechanical, Electronics Technology, Materials Science, or a comparable field, with 0-3 years of hands-on lab or manufacturing experience, OR an Associate's degree in a relevant technical field with 6-8 years of lab or manufacturing experience.
- Proficiency in using advanced lab tools, such as dual-beam Focused Ion Beam (FIB) systems and TEM imaging equipment.
- Strong understanding of sample preparation techniques and lab protocols.
Nice to have
- Previous experience working in a semiconductor manufacturing or analytical lab environment.
- Familiarity with laboratory-scale tools and pipetting techniques.
Skills: electron microscopy, ultra-thin specimens, TEM analysis, Focused Ion Beam (FIB), sample preparation
This role has been open 0 days — well below the 46-day median for Failure Analysis Engineering roles.
Failure Analysis Engineering · Failure Analysis
|
Open roles in category
189
|
Median days open
46 d
|
Median salary
$113k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Intel Corporation | All employers we track in this specialty (189 roles · 39 employers) |
|---|---|---|
| Open roles in this specialty | 11 | 189 |
| Open roles in the wider Process, Fab & Equipment family | 170 | 9328 · 108 employers |
| Median days open | 35 d | 46 d (−11 d vs this employer) |
| Median salary (USD postings) | — | $113k |
Skills observed across this category: electron microscopy, ultra-thin specimens, TEM analysis, Focused Ion Beam (FIB), sample preparation
Who's hiring in this category
- Micron Technology · 34 open roles · median 67 d
- AMD · 14 open roles · median 54 d
- Infineon Technologies · 13 open roles · median 40 d
- Lam Research · 13 open roles · median 38 d
- Intel Corporation (this employer) · 11 open roles · median 35 d
- NVIDIA · 8 open roles · median 62 d
How we counted: 189 open Failure Analysis Engineering (Failure Analysis) roles from 39 employers tracked in the SemiconductorJobs index, counted 19 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.