ATD Laser Development Engineer - Arizona, Phoenix, United States
$85,200 - $162,500 USD yearly
Originally posted 7 July 2026 by the employer.
About the role
This role focuses on laser assembly and packaging module development for semiconductor packaging technologies.
What you'll do
- Design and develop laser assembly packaging processes and equipment. - Optimize manufacturing processes to meet quality, reliability, cost, yield, productivity, and manufacturability requirements. - Develop process and equipment specifications using Design of Experiments (DOE) and data analysis principles. - Oversee the manufacturability of physical layout designs and manage the full cycle of packaging processes, procedures, and flows. - Establish laser process specifications, set laser process reliability requirements based on failure mechanisms, and collaborate with suppliers to meet quality standards. - Innovate new techniques, tools, and quality screens for early identification of potential packaging quality and reliability issues.
What you'll need
- Bachelor's or Master's degree in Physics, Mechanical Engineering, Optical Engineering, or a related STEM field. - Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles. - Fundamental understanding of laser and optical systems.
Nice to have
- Hands-on experience in a technology manufacturing environment or semiconductor packaging processes and troubleshooting laser based equipment/systems. - Familiarity with equipment adjustment, process characterization, and manufacturability in semiconductor or electronics assembly. - Capability to apply Data Science and Statistics tools (Python, Numpy/Pandas, SQL, JMP, Minitab) to manipulate large complex data sets.
Skills: laser assembly, packaging processes, semiconductor packaging, equipment development, quality, reliability, cost, yield
This role has been open 106 days — well above the 57-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
212
|
Median days open
57 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Intel Corporation | All employers we track in this specialty (212 roles · 43 employers) |
|---|---|---|
| Open roles in this specialty | 9 | 212 |
| Open roles in the wider Process, Fab & Equipment family | 186 | 10066 · 107 employers |
| Median days open | 107 d | 57 d (+50 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Skills observed across this category: laser assembly, packaging processes, semiconductor packaging, equipment development, quality, reliability, cost, yield
Who's hiring in this category
- Infineon Technologies · 28 open roles · median 43 d
- Renesas Electronics · 27 open roles · median 36 d
- Micron Technology · 21 open roles · median 103 d
- onsemi · 15 open roles · median 26 d
- Monolithic Power Systems · 11 open roles · median 215 d
- Intel Corporation (this employer) · 9 open roles · median 106 d
How we counted: 212 open Packaging Engineering (Packaging) roles from 43 employers tracked in the SemiconductorJobs index, counted 21 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.