Assembly Die Bond Process Engineer - Kuala Lumpur, Malaysia
Originally posted 2 September 2026 by the employer.
About the role
This role involves developing, optimizing, and sustaining die bonding processes within semiconductor assembly manufacturing, focusing on achieving high product quality, yield improvement, process stability, cycle time reduction, and cost efficiency. The engineer will support new product introductions (NPI) and continuous improvement initiatives.
What you'll do
- Develop, qualify, and optimize die bonding processes for semiconductor packages.
- Establish process parameters and operating specifications.
- Provide daily engineering support to manufacturing operations and troubleshoot die bond process-related issues.
- Analyze yield losses and process excursions, implementing corrective and preventive actions (CAPA).
- Monitor process capability (Cp/Cpk) and manufacturing yields.
- Drive cost reduction, productivity enhancement, and waste elimination projects.
What you'll need
- Bachelor or Master in related engineering major.
- Semiconductor experience in Die bond.
- Experience with root cause analysis using tools such as 8D, Fishbone, 5 Why, and FMEA.
- Familiarity with Lean Manufacturing and Six Sigma methodologies.
Skills: die bonding processes, semiconductor packages, process characterization, yield improvement, new package development
This role has been open 22 days — well below the 70-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
198
|
Median days open
70 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | NXP Semiconductors | All employers we track in this specialty (198 roles · 42 employers) |
|---|---|---|
| Open roles in this specialty | 5 | 198 |
| Open roles in the wider Process, Fab & Equipment family | 120 | 9525 · 109 employers |
| Median days open | 22 d | 70 d (−48 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Skills observed across this category: die bonding processes, semiconductor packages, process characterization, yield improvement, new package development
Who's hiring in this category
- Infineon Technologies · 29 open roles · median 35 d
- Renesas Electronics · 20 open roles · median 27 d
- Micron Technology · 18 open roles · median 146 d
- Monolithic Power Systems · 12 open roles · median 188 d
- Intel Corporation · 11 open roles · median 153 d
- onsemi · 8 open roles · median 51 d
How we counted: 198 open Packaging Engineering (Packaging) roles from 42 employers tracked in the SemiconductorJobs index, counted 24 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.