Advanced Substrate Design & Process Integration
Originally posted 3 November 2026 by the employer.
About the role
This role leads the development of substrate architecture, design rules, and technology platforms to enable future packaging solutions. You will focus on substrate design enablement, process integration, design-for-manufacturability (DFM), design-for-yield (DFY), reliability, and electrical performance optimization across packaging, silicon, and manufacturing teams.
What you'll do
- Define substrate technology requirements, design roadmaps, stack-up methodologies, routing architectures, and design rules across line/space scaling, via technologies, and advanced package integration.
- Lead design-process co-optimization activities across substrate manufacturing technologies and collaborate with suppliers to establish process windows, design limitations, and readiness assessments.
- Develop design methodologies that maximize manufacturing yield, identify systematic design sensitivities impacting supplier yield and cost, and drive yield learning initiatives.
- Lead substrate reliability strategy and design rule development for mechanical and electrical robustness while evaluating failure mechanisms.
- Drive substrate architecture solutions for signal integrity, power integrity, and high-speed package performance supporting AI, HPC, and heterogeneous integration products.
- Influence substrate supplier technology roadmaps, evaluate emerging substrate technologies, and establish technical targets for development partners.
What you'll need
- Technical expertise in substrate design architecture, process integration, substrate manufacturing technologies, and package-system co-design.
- Experience developing substrate design rules and technology platforms used in semiconductor products.
- Knowledge of the tradeoffs between electrical performance, mechanical reliability, manufacturability, and cost.
- Experience bridging product requirements with manufacturing capabilities across package architects, silicon teams, and manufacturing partners.
Nice to have
- Experience in advanced packaging, substrate design, or package technology development.
- Deep expertise in substrate stack-up architecture, routing technologies, HDI design, and advanced package substrates.
- Extensive experience developing substrate design rules for manufacturing and reliability.
- Strong understanding of signal integrity, power integrity, and package electrical performance.
- Experience with design-for-manufacturability, design-for-yield, and design-process co-optimization.
- Strong understanding of substrate manufacturing processes and process integration principles.
- Experience supporting advanced package architectures including chiplet, 2.5D, and heterogeneous integration solutions.
- Proven ability to influence technical direction across multiple organizations and suppliers.
- Demonstrated success presenting strategy and technical roadmaps to senior leadership.
Skills: substrate architecture, design rules, process integration, DFM, advanced packaging, chiplet
More semiconductor jobs: AMD jobs · Advanced packaging jobs · Texas jobs
This role has been open 0 days — well below the 53-day median for Chiplet/Advanced Packaging Design roles.
Chiplet/Advanced Packaging Design · Advanced Packaging
|
Open roles in category
74
|
Median days open
53 d
|
Category median salary (all employers)
$176k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | AMD | All employers we track in this specialty (74 roles · 26 employers) |
|---|---|---|
| Open roles in this specialty | 14 | 74 |
| Median days open | 24 d | 53 d (−29 d vs this employer) |
| Median salary (USD postings) | — | $176k |
Skills observed across this category: substrate architecture, design rules, process integration, DFM, advanced packaging, chiplet
Who's hiring in this category
- AMD (this employer) · 12 open roles · median 41 d
- Micron Technology · 10 open roles · median 185 d
- Marvell Technology · 6 open roles · median 31 d
- NVIDIA · 6 open roles · median 56 d
- Qualcomm · 4 open roles · median 98 d
- Broadcom · 3 open roles · median 94 d
How we counted: 74 open Chiplet/Advanced Packaging Design (Advanced Packaging) roles from 26 employers tracked in the SemiconductorJobs index, counted 3 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.