Advanced Packaging Process Engineer III (E3) - Santa Clara, CA, United States
$124,000 - $171,000 USD yearly
Originally posted 26 June 2026 by the employer. Relisted by the employer on 29 September 2026.
About the role
Applied Materials is seeking an Advanced Packaging Process Engineer III (E3) in Santa Clara, CA to drive process engineering experiments and hardware characterization.
What you'll do
- Design, collect data, analyze, and compile reports on difficult process engineering experiments. - Perform hardware characterization on a variety of difficult systems. - Troubleshoot complex problems, perform Root Cause Analysis, and resolve process engineering issues. - Measure film properties and interpret experimental data. - Generate internal documentation for products, presentations, and technical reports. - Communicate and engage with customers and partner with vendors and suppliers to resolve complex process engineering issues.
What you'll need
- BS or MS Degree in Electrical, Chemical or Mechanical Engineering, Materials Science, Physics, or a related field. - 4-7 years of related experience. - Experience with electronic packaging fabrication such as W2W and D2W bonding. - Hands-on experience with tool operation and process development in the PCB or semiconductor industry. - Practical expertise in complex problem solving and Root Cause Analysis.
Skills: advance packaging projects, packaging substrate fabrication, process development, cu electroplating, semiconductor manufacturing
This role has been open 118 days — well above the 63-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
303
|
Median days open
63 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Applied Materials | All employers we track in this specialty (303 roles · 58 employers) |
|---|---|---|
| Open roles in this specialty | 11 | 303 |
| Open roles in the wider Process, Fab & Equipment family | 1143 | 10119 · 106 employers |
| Median days open | 118 d | 63 d (+55 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Skills observed across this category: advance packaging projects, packaging substrate fabrication, process development, cu electroplating, semiconductor manufacturing
Who's hiring in this category
- KLA Corporation · 44 open roles · median 133 d
- Micron Technology · 40 open roles · median 39 d
- Renesas Electronics · 20 open roles · median 43 d
- Intel Corporation · 19 open roles · median 28 d
- GlobalFoundries · 14 open roles · median 65 d
- Lumilens · 13 open roles · median 76 d
How we counted: 303 open Packaging Engineering (Advanced Packaging) roles from 58 employers tracked in the SemiconductorJobs index, counted 22 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.