Senior NPI Engineer - Dong Nai, Viet Nam, Vietnam
Originally posted 1 October 2026 by the employer.
Focus on power module packaging.
About the role
This role involves introducing and maintaining assembly processes and activities to meet manufacturing and quality requirements. You will be responsible for new product/package/technology transfer, production setup, and validation in the factory, with a focus on power module packaging and chip package (CPI).
What you'll do
- Introduce and maintain assembly processes to meet manufacturing and quality requirements.
- Drive new product/package/technology transfer, production setup, and validation.
- Define risk assessment, risk mitigation plans, Bill of Material (BOM) selection, and process flow.
- Perform technical gap analysis, Design for Manufacturability, and cost competitiveness considerations.
- Troubleshoot, investigate, and conduct root cause analysis for qualification failures and method issues.
- Implement new products from engineering build to manufacturability using DOE, SIPOC, and Lean Six Sigma.
What you'll need
- BS/MS in Electrical, Mechanical Engineering, Material Engineering, Science and Technology, Chemistry, Physics or equivalent.
- Minimum of 5 years of experience in semiconductor packaging and manufacturing.
- Experience in assembly processes of Plasma Cleaning, Coating, Molding, Plating Chemistry, Chemical Deflash, Trim and Form.
- Knowledgeable on Thermosetting Plastic such as Epoxy Molding Compound, Plating chemistry, Chemical deflash, Lead frame, Substrate, Direct Bond Copper Ceramic.
- Proficiency in Engineering Tools such as AutoCAD, 8D, SPC, DFMEA, DOE.
- Experience in power module packaging, reliability, and chip package (CPI).
Nice to have
- Semiconductor or silicon/silicon carbide wafer processing experience.
- Experience in data analysis using JMP, Minitab, Power BI.
Skills: semiconductor packaging, new product/package/technology transfer, assembly processes, Design for Manufacturability, power module packaging, chip package (CPI)
This role has been open 0 days — well below the 74-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
196
|
Median days open
74 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | onsemi | All employers we track in this specialty (196 roles · 42 employers) |
|---|---|---|
| Open roles in this specialty | 13 | 196 |
| Open roles in the wider Process, Fab & Equipment family | 266 | 9579 · 109 employers |
| Median days open | 15 d | 74 d (−59 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Skills observed across this category: semiconductor packaging, new product/package/technology transfer, assembly processes, Design for Manufacturability, power module packaging, chip package (CPI)
Who's hiring in this category
- Infineon Technologies · 26 open roles · median 42 d
- Renesas Electronics · 23 open roles · median 34 d
- Micron Technology · 17 open roles · median 148 d
- onsemi (this employer) · 12 open roles · median 18 d
- Monolithic Power Systems · 11 open roles · median 195 d
- Intel Corporation · 10 open roles · median 171 d
How we counted: 196 open Packaging Engineering (Packaging) roles from 42 employers tracked in the SemiconductorJobs index, counted 1 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.