Advanced Packaging Intern, MS - Summer 2027
$37 - $73 USD yearly
Originally posted 6 September 2026 by the employer — open 4 days.
About the role
This role is for an Advanced Packaging Intern focusing on supporting customers with package designs that meet challenging electrical requirements.
What you'll do
- Perform signal integrity (SI), power integrity (PI), and electromagnetic (EM) simulations for advanced packaging and high-speed interconnects.
- Evaluate package and PCB designs to ensure electrical performance requirements are met.
- Analyze power distribution networks (PDNs) and high-speed channels to identify and resolve signal and power delivery issues.
- Execute simulation and verification activities supporting SI/PI sign-off.
- Collaborate with package design, layout, hardware, and IP teams to optimize electrical performance.
- Develop scripts and automation tools using Python, MATLAB, or similar tools to improve analysis workflows.
- Document results and present technical findings to cross-functional engineering teams.
What you'll need
- Master's Degree program studying Electrical Engineering, Computer Engineering, or a related discipline, with an expected graduation date between Fall 2027 – Summer 2028.
- Interest in hardware design and experience working on signal and power integrity verification and design optimization.
- Strong understanding of electromagnetic fundamentals, signal integrity concepts and circuit simulation techniques.
- Knowledge of circuit simulation techniques and experience evaluating electrical behavior of package, PCB, or interconnect structures.
- Exposure to frequency-domain and time-domain analysis methodologies.
- Experience with electrical simulation tools for signal integrity, power integrity, or electromagnetic analysis.
- Ability to organize technical information, analyze data, document results, and communicate findings effectively.
Nice to have
- Experience evaluating package or PCB designs for challenging electrical requirements.
- Hands-on experience with 2-D/3-D electromagnetic simulation tools such as Ansys HFSS, SIwave, Cadence Clarity, or similar tools.
- Experience performing signal integrity (SI), power integrity (PI), channel analysis, power distribution network (PDN) analysis, or related simulation activities.
- Familiarity with advanced packaging technologies, including 2.5D and 3D packaging architectures.
- Familiarity with IC package design and layout tools such as Cadence APD or equivalent.
- Proficiency in MATLAB, Python, or other scripting languages for data analysis, automation, or workflow development.
- Strong presentation, documentation, and technical communication skills.
Skills: signal integrity, power integrity, electromagnetic simulations, advanced packaging, high-speed interconnects, PDN analysis
This role has been open 4 days — well below the 40-day median for Chiplet/Advanced Packaging Design roles.
Chiplet/Advanced Packaging Design · Advanced Packaging
|
Open roles in category
69
|
Median days open
40 d
|
Median salary
$206k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Marvell Technology | All employers we track in this specialty (69 roles · 23 employers) |
|---|---|---|
| Open roles in this specialty | 10 | 69 |
| Median days open | 42 d | 40 d (+2 d vs this employer) |
| Median salary (USD postings) | — | $206k |
Skills observed across this category: signal integrity, power integrity, electromagnetic simulations, advanced packaging, high-speed interconnects, PDN analysis
Who's hiring in this category
- Micron Technology · 11 open roles · median 132 d
- Marvell Technology (this employer) · 9 open roles · median 44 d
- AMD · 7 open roles · median 16 d
- Amazon · 5 open roles · median 9 d
- Broadcom · 5 open roles · median 152 d
- NVIDIA · 4 open roles · median 25 d
How we counted: 69 open Chiplet/Advanced Packaging Design (Advanced Packaging) roles from 23 employers tracked in the SemiconductorJobs index, counted 10 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.