Advanced Packaging Intern, BS - Summer 2027 - Burlington, VT, United States
$31 - $62 USD yearly
Originally posted 9 September 2026 by the employer — open 1 day.
Focus on 3D packaging, Co-packaged optics, and advanced substrate materials.
About the role
This role involves supporting customers with package designs that meet challenging electrical requirements. The team is advancing expertise in 3D packaging, Co-packaged optics, and substrate materials.
What you'll do
- Evaluate package or PCB designs for challenging electrical requirements.
- Interact with physical designers and IP teams to optimize electrical performance.
- Execute simulation tasks for signal and power integrity sign-off.
What you'll need
- Currently enrolled in a Bachelor's Degree program studying Electrical Engineering, planning to complete studies in 2028.
- Interest in hardware design.
- Strong understanding of electromagnetic fundamentals, signal integrity concepts, and circuit simulation techniques.
- Knowledge of Electrical Engineering concepts, circuit extractions, and simulation.
- Knowledge of design methodology and strategies.
- Communication, presentation, and documentation skills.
Skills: 3D packaging, Co-packaged optics, substrate materials, signal and power integrity, electrical requirements, multi-chip
This role has been open 1 day — well below the 40-day median for Chiplet/Advanced Packaging Design roles.
Chiplet/Advanced Packaging Design · Advanced Packaging
|
Open roles in category
69
|
Median days open
40 d
|
Median salary
$206k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Marvell Technology | All employers we track in this specialty (69 roles · 23 employers) |
|---|---|---|
| Open roles in this specialty | 10 | 69 |
| Median days open | 42 d | 40 d (+2 d vs this employer) |
| Median salary (USD postings) | — | $206k |
Skills observed across this category: 3D packaging, Co-packaged optics, substrate materials, signal and power integrity, electrical requirements, multi-chip
Who's hiring in this category
- Micron Technology · 11 open roles · median 132 d
- Marvell Technology (this employer) · 9 open roles · median 44 d
- AMD · 7 open roles · median 16 d
- Amazon · 5 open roles · median 9 d
- Broadcom · 5 open roles · median 152 d
- NVIDIA · 4 open roles · median 25 d
How we counted: 69 open Chiplet/Advanced Packaging Design (Advanced Packaging) roles from 23 employers tracked in the SemiconductorJobs index, counted 10 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.