Advanced Packaging Integration Engineer - Santa Clara, CA, United States
$138,000 - $190,000 USD yearly
Originally posted 28 July 2026 by the employer.
About the role
As an Advanced Packaging Integration Engineer in the Photonics Platform Business Group, you will lead process integration for high-performance interconnects and micro-LED panels. You will architect robust, scalable integration flows that meet manufacturability and reliability requirements across smart glasses and optical interconnect applications.
What you'll do
- Define, develop, execute, and optimize advanced packaging process integration flows, including hybrid bonding and 2.5D/3D heterogeneous integration, to support product performance, yield, and reliability. - Own, manage, and drive complex technical projects, tracking progress and solving roadblocks to deliver milestones on schedule. - Design experiments, systematically collect and analyze data, lead root-cause analysis, and implement corrective actions. - Collaborate with foundries, OSATs, and internal research teams to define and implement integration strategies and methodologies. - Track industry developments and apply that technical knowledge to packaging solutions.
What you'll need
- Ph.D. or M.S. degree in Materials Science, Electrical Engineering, Chemical Engineering, Applied Physics, or a related STEM field. - Hands-on experience in advanced packaging technologies, including wafer-to-wafer or die-to-wafer hybrid bonding, semiconductor processing, 2.5D/3D integration, TSV, RDL, underfill, bumping, molding, and OSAT processes. - Proficiency in statistical data analysis and process optimization and control techniques, such as Design of Experiments (DOE), SPC, and JMP.
Nice to have
- Micro-LED or CPO experience. - Coding capability. - Experience with MES systems. - Ability to prepare clear executive-level or customer-facing presentations.
Skills: silicon photonics packaging, advanced packaging, 3D integration, optical interconnects, co-packaged optics, microLED panels
This role has been open 174 days — well above the 50-day median for Chiplet/Advanced Packaging Design roles.
Chiplet/Advanced Packaging Design · Advanced Packaging
|
Open roles in category
71
|
Median days open
50 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Applied Materials | All employers we track in this specialty (71 roles · 24 employers) |
|---|---|---|
| Open roles in this specialty | 2 | 71 |
| Median days open | 90 d | 50 d (+40 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Skills observed across this category: silicon photonics packaging, advanced packaging, 3D integration, optical interconnects, co-packaged optics, microLED panels
Who's hiring in this category
- AMD · 11 open roles · median 50 d
- Micron Technology · 9 open roles · median 179 d
- NVIDIA · 7 open roles · median 28 d
- Marvell Technology · 6 open roles · median 24 d
- Broadcom · 4 open roles · median 149 d
- GlobalFoundries · 4 open roles · median 117 d
How we counted: 71 open Chiplet/Advanced Packaging Design (Advanced Packaging) roles from 24 employers tracked in the SemiconductorJobs index, counted 27 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.