Advanced Packaging & Integration Co-op Student - Canada - Ottawa (Bill Leathem), Canada
Originally posted 9 September 2026 by the employer — open 12 days.
This role contributes to the development of our Optical Circuit Switch (OCS).
About the role
This role involves working in the R&D process group within the Advanced Packaging and Integration Team to contribute to the development of optical circuit switches. The co-op student will be engaged in the development and execution of package assembly, integration, and sealing processes involving materials science, thermal design, and process control considerations.
What you'll do
- Work with the engineering team to understand key factors affecting the manufacturing process and use DOE to develop experimental plans.
- Improve and develop tools, jigs, and fixtures to increase manufacturability.
- Analyze data to show the trend of the impact of key parameters on process quality.
- Maintain well-organized records of experimental results and progress, including standard documentation.
- Work in R&D lab and clean room environments with industrial machinery.
- Share progress and outcomes with stakeholders for feedback and continuous improvements, and provide regular updates and reports.
What you'll need
- Currently enrolled in 3rd or 4th year in Mechanical Engineering, Mechatronics Engineering, Nanotech Engineering, Engineering Physics, or other Engineering/Science disciplines at a recognized Canadian post-secondary institution.
- Mechanical design skills.
- Ability to use SolidWorks or SolidEdge 3D mechanical design tools.
- Previous experience and demonstrated ability in mechanical designing, conducting, and analyzing experiments.
- Knowledgeable with lean manufacturing techniques.
- Understanding of using and troubleshooting industrial machinery.
Nice to have
- Familiarity with Python, computer vision, and AI.
This role has been open 12 days — well below the 57-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
296
|
Median days open
57 d
|
Median salary
$172k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Lumentum | All employers we track in this specialty (296 roles · 58 employers) |
|---|---|---|
| Open roles in this specialty | 3 | 296 |
| Open roles in the wider Process, Fab & Equipment family | 97 | 9417 · 108 employers |
| Median days open | 20 d | 57 d (−37 d vs this employer) |
| Median salary (USD postings) | — | $172k |
Who's hiring in this category
- KLA Corporation · 49 open roles · median 103 d
- Micron Technology · 37 open roles · median 32 d
- Infineon Technologies · 19 open roles · median 42 d
- Renesas Electronics · 19 open roles · median 22 d
- Lumilens · 13 open roles · median 46 d
- onsemi · 13 open roles · median 25 d
How we counted: 296 open Packaging Engineering (Advanced Packaging) roles from 58 employers tracked in the SemiconductorJobs index, counted 22 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.