Advanced Packaging Development Engineer - Arizona, Phoenix, United States
$133,800 - $188,890 USD yearly
Originally posted 27 October 2026 by the employer.
About the role
This role drives the design and optimization of packaging processes and equipment within Intel's Advanced Packaging Technology Manufacturing (APTM) organization. Responsibilities include developing solutions to enhance reliability, manufacturability, and performance in high-volume manufacturing environments.
What you'll do
- Develop, optimize, and qualify packaging assembly processes, materials, and equipment to meet quality, reliability, yield, and cost targets. - Drive experimental design using methodologies such as Statistical Process Control (SPC) and Design of Experiments (DOE). - Innovate new techniques, materials, and tools to address emerging challenges in packaging reliability and manufacturability. - Establish process specifications and material requirements while working with suppliers to meet quality standards. - Provide support for equipment performance and process health across development and high-volume manufacturing environments. - Document technical findings, process improvements, and advancements through reports and technical papers.
What you'll need
- Bachelor's degree in Engineering, Physics, Chemistry, or a related STEM field with 3+ years of industry experience; OR a Master's degree with 2+ years of industry experience; OR a PhD in a relevant STEM field. - Experience with process development and/or equipment qualification for manufacturing applications. - Strong analytical skills, including data analysis and risk assessment.
Nice to have
- Experience in Statistical Process Control (SPC), Design of Experiments (DOE), and process characterization techniques. - Experience with semiconductor fabrication processes, packaging flows, and assembly methodologies. - Knowledge of quality systems, documentation standards, and tools for packaging reliability evaluation. - Proficiency in programming languages such as Python, MATLAB, or SQL to analyze complex datasets. - Experience leading technical teams and collaborating across matrixed organizations.
Skills: packaging assembly, process development, SPC, DOE, equipment qualification
This role has been open 0 days — well below the 63-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
295
|
Median days open
63 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Intel Corporation | All employers we track in this specialty (295 roles · 59 employers) |
|---|---|---|
| Open roles in this specialty | 21 | 295 |
| Open roles in the wider Process, Fab & Equipment family | 191 | 10147 · 107 employers |
| Median days open | 33 d | 63 d (−30 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Skills observed across this category: packaging assembly, process development, SPC, DOE, equipment qualification
Who's hiring in this category
- KLA Corporation · 42 open roles · median 138 d
- Micron Technology · 39 open roles · median 45 d
- Intel Corporation (this employer) · 20 open roles · median 30 d
- Renesas Electronics · 19 open roles · median 43 d
- GlobalFoundries · 14 open roles · median 70 d
- Lumilens · 13 open roles · median 81 d
How we counted: 295 open Packaging Engineering (Advanced Packaging) roles from 59 employers tracked in the SemiconductorJobs index, counted 27 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.