半導体組立工程 技術開発エンジニア(2) - Yonezawa, Japan
Originally posted 14 September 2026 by the employer — open 5 days.
About the role
This role involves technology development in semiconductor post-process assembly and packaging. You will engage in the development of high-density and high-reliability packages for AI/HPC, automotive, and IoT applications.
What you'll do
- Develop and evaluate advanced package technologies such as FCLGA, FCCSP, and BGA.
- Develop and improve assembly process steps, including solder paste printing, component mounting, FC Bond, reflow, and flux cleaning.
- Support manufacturing line startup and mass production transition.
- Improve process quality and yield.
What you'll need
- 4+ years of experience in semiconductor post-process (assembly/packaging) technology development.
- 4+ years of experience in SMT process technology development.
- Practical experience in process improvement, quality control, and equipment introduction.
- Technical degree (Mechanical, Materials, Electronics, Chemistry).
Skills: 次世代パッケージ技術, Flip Chip, SiP, FCCSP, FCBGA, 組立工程, プロセス開発
This role has been open 5 days — well below the 53-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
299
|
Median days open
53 d
|
Median salary
$179k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Renesas Electronics | All employers we track in this specialty (299 roles · 58 employers) |
|---|---|---|
| Open roles in this specialty | 21 | 299 |
| Open roles in the wider Process, Fab & Equipment family | 174 | 9328 · 108 employers |
| Median days open | 19 d | 53 d (−34 d vs this employer) |
| Median salary (USD postings) | — | $179k |
Skills observed across this category: 次世代パッケージ技術, Flip Chip, SiP, FCCSP, FCBGA, 組立工程
Who's hiring in this category
- KLA Corporation · 49 open roles · median 100 d
- Micron Technology · 36 open roles · median 27 d
- Renesas Electronics (this employer) · 21 open roles · median 19 d
- Infineon Technologies · 18 open roles · median 39 d
- Intel Corporation · 13 open roles · median 74 d
- Lumilens · 13 open roles · median 43 d
How we counted: 299 open Packaging Engineering (Advanced Packaging) roles from 58 employers tracked in the SemiconductorJobs index, counted 19 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.