HBM and Advanced Packaging Jobs: Where Companies Are Hiring
SK hynix reports third quarter results on October 28 and Samsung Electronics follows on October 29. Higher memory prices and demand for high bandwidth memory (HBM) used alongside AI processors are expected to drive both reports. Samsung already guided to about KRW 107.4 trillion in operating profit for the quarter, and Micron reported fiscal Q4 revenue of $54.23 billion (Reuters via Investing.com, Micron).
Investors are asking how long the spending lasts. For engineers, the more useful question is where the job postings are. This post looks at what our job index shows for HBM and advanced packaging work today.
What the earnings calls will focus on
One topic to watch is HBM4 supply for Nvidia's Vera Rubin platform. AMD said its MI455 accelerators built on HBM4 have started shipping with support from both Samsung and SK hynix (The Inference). Samsung and Micron both expect memory supply to stay tight into 2028, while analysts point to Chinese competition and a possible slowdown in AI spending as risks.
HBM and packaging postings in our job index
We track more than 37,000 active semiconductor job postings. Of those, 960 mention HBM or high bandwidth memory in the title or description. Separately, 1,030 postings cover advanced packaging, heterogeneous integration, packaging substrates or silicon photonics. The two groups overlap: 337 postings appear in both, for 1,653 unique postings. Not every packaging posting is HBM work, since the broader group also includes general assembly, substrate and photonics roles.
Micron has the largest share of the broader packaging and integration group with 333 postings, about 32%. Next are Intel (62), GlobalFoundries (54), KLA (47), AMD (35) and Applied Materials (34).
Where Micron's packaging postings are
Micron's packaging and memory integration postings are concentrated in four locations:
- Singapore: 82
- Taichung, Taiwan: 71
- Richardson, Texas: 62
- Boise, Idaho: 35
You can see some of Micron's current openings on our Micron Technology jobs page.
Design versus manufacturing work
Based on job titles, 234 of the packaging postings are design and analysis roles: package architecture, signal and power integrity, thermal and mechanical simulation. Another 303 are process, assembly, equipment, substrate, integration and yield roles. The rest use general titles that do not fit either group.
Published pay in the US
Among 104 US postings in the packaging group with published base salaries, the median listed minimum is $133,800 and the median listed maximum is $219,550. These figures exclude bonuses and equity.
What to watch this week
On this week's calls, I'll be watching for updates on HBM4 production, packaging capacity and capital spending. We'll then compare new, closed and reposted positions in our job index with this snapshot.
Browse open roles from all employers on our advanced packaging jobs page and packaging engineer jobs page. For fab hiring by state, see US fab hiring: where the process and equipment jobs are.
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We track more than 37,000 active job postings across 170 semiconductor companies worldwide. Upload your resume for a confidential report on any current positions you qualify for.
Job counts and published salaries are from our job index as of October 27, 2026. Active job postings; evergreen talent pools excluded from pay figures. Design and manufacturing splits are based on job titles. Earnings figures are company guidance and reported results published before the October 28 and 29 reports.