GaN, SiC and Compound Semiconductor Jobs: Who Is Hiring
Gallium nitride and silicon carbide are usually discussed together, but the hiring covers several different markets.
GaN is used in high frequency power conversion and RF systems. SiC is more common in higher voltage applications such as electric vehicle inverters, fast chargers, industrial power systems and data center infrastructure. Employers also need engineers for wafer processing, epitaxy, packaging, reliability and device testing.
As of November 7, 2026, our job index tracks 154 active postings across GaN, SiC, wide bandgap and compound semiconductor engineering.
That includes:
- 51 GaN only postings
- 37 SiC only postings
- 29 postings mentioning both
- 37 other compound semiconductor postings
Each employer posting is counted once. These figures come from our full job index. The public job board contains a selection of these positions.
AI data centers are becoming another market
Electric vehicles remain an important market for SiC, but recent announcements show why AI infrastructure is becoming more relevant to both materials.
On November 5, Infineon and SOLUM announced expanded work on high voltage direct current (HVDC) power systems for AI data centers. The work covers power supplies, battery backup systems and intermediate bus converters using silicon, SiC and GaN devices.
Two days earlier, Navitas reported that third quarter revenue increased 38% from a year earlier, primarily because of growth in US data center revenue.
Wolfspeed’s November 4 results also highlighted a new 200 mm SiC wafer agreement with Infineon and a multiyear device agreement supporting BorgWarner’s 800 V inverter platform.
Infineon recently announced a €1.1 billion investment in a 300 mm GaN manufacturing facility in Villach, Austria.
Our job index currently shows 6 Infineon GaN or SiC postings in Austria, all in Villach, covering SiC epitaxy, wide bandgap process integration, GaN product development and GaN product marketing. None of the six were first posted after the October 27 facility announcement.
Who is hiring
The largest employers in this group are:
| Employer | Active postings | Main area of work |
|---|---|---|
| Infineon Technologies | 19 | Power devices, process development and manufacturing |
| Navitas Semiconductor | 14 | GaN and SiC power systems for data centers and industrial applications |
| STMicroelectronics | 11 | SiC devices, manufacturing and automotive power |
| onsemi | 11 | SiC power devices and industrial applications |
| MACOM | 11 | GaN RF, microwave and compound semiconductor devices |
| Wolfspeed | 9 | SiC materials, wafers and power devices |
| Nexperia | 9 | GaN power devices and applications |
| Renesas Electronics | 9 | Power systems, gate drivers and device applications |
| Coherent Corp | 8 | Compound semiconductor wafer processing, epitaxy and device engineering |
| Lumentum | 8 | Compound semiconductor epitaxy, MOCVD process development and laser design |
No employer accounts for more than 13% of the 154 postings. Hiring is spread across large power semiconductor companies, specialist GaN and SiC suppliers, and RF device manufacturers.
Browse the Wolfspeed positions currently published on our job board.
What the positions are supporting
Each posting is assigned to one primary application, so the categories do not overlap:
| Primary application | Active postings |
|---|---|
| AI data centers, grid and power conversion | 13 |
| Automotive and electric vehicles | 23 |
| RF, microwave and radar | 19 |
| Materials, epitaxy and wafer processing | 41 |
| Industrial power and renewable energy | 20 |
| Other applications | 38 |
Materials, epitaxy and wafer processing is the largest group. Automotive accounts for 23 postings. Another 13 cover AI data centers, grid systems or broader power conversion. Many postings in the other group are general device or manufacturing roles that do not name one end market.
Where the jobs are
The United States has the largest individual share, but most positions in this group are located elsewhere.
| Country or region | Active postings |
|---|---|
| United States | 64 |
| Germany | 14 |
| Austria | 6 |
| Taiwan | 13 |
| Italy | 9 |
| China | 9 |
| India | 9 |
| Malaysia | 6 |
| Japan | 5 |
| Other or multiple locations | 19 |
| Total | 154 |
The five largest individual hiring sites are:
- Durham, North Carolina: 9 postings
- Sherman, Texas: 8 postings
- Pune, India: 8 postings
- Hamburg, Germany: 6 postings
- Villach, Austria: 6 postings
Published US salaries
20 US postings in this group publish annual base salary ranges. The median listed minimum is $105,000, and the median listed maximum is $187,500.
Current examples include:
| Company and position | Location | Published base salary |
|---|---|---|
| Navitas Semiconductor, Senior Director, GaN Technology | Torrance, California | $225,000 to $275,000 |
| Navitas Semiconductor, Director, Ultra High Voltage SiC Device Technology | Torrance, California | $200,000 to $250,000 |
| GlobalFoundries, PMTS Field Application Engineer, Power GaN and BCD | Texas and New York | $145,000 to $236,000 |
| Vishay Intertechnology, Staff SiC Device and Process Engineer | San Jose, California | $160,000 to $225,000 |
| Power Integrations, Staff or Senior Staff GaN Technologist | San Jose, California | $140,000 to $210,000 |
These are employer-published base salary ranges. They exclude bonuses and equity.
How active is the hiring
Of the 154 active postings:
- 52 were first posted during the past 30 days
- 60 have been open for at least 90 days
- 22 were reposted or reopened
Nearly four in ten active postings have remained open for at least 90 days. A posting can stay open for several reasons, but a substantial share of these positions have remained active for months.
Removed postings are not treated as completed hires. Employers also remove jobs when budgets change, postings expire or the same work is listed under a new job posting number.
What the roles require
The most common technical requirements include:
- GaN and SiC device physics
- Epitaxy and crystal growth using MOCVD or CVD
- High voltage device characterization
- Wafer process development
- Gate drivers and power stage design
- Power packaging and thermal analysis
- Reliability testing and qualification
- RF and microwave device design
Automotive remains a larger hiring category, but recent company announcements show AI data centers becoming another target market for GaN and SiC power devices.
Browse power electronics and power management IC jobs.
Job counts and salary figures are from our job index as of November 7, 2026. Each employer posting is counted once. Skill and technology counts are based on the title and full job description.