PMTS Field Application Eng - Power GaN & BCD

Originally posted 9 July 2026 by the employer. Relisted by the employer on 29 October 2026.

About the role

The Field Application Eng (FAE) engages with customers early to assess technical needs and identify GlobalFoundries technical solutions for Power technology (BCD & GaN), driving opportunities toward design win (DWIN) and product tapeout. You will work cross-functionally with account managers, product marketing, and technical experts to resolve adoption barriers and convert customer opportunities into revenue.

What you'll do

• Engage with customers to understand technical needs for developing their semiconductor IC products.
• Assess the competitive landscape to identify and advocate GlobalFoundries value propositions and advocate internally for improved features to close competitive gaps.
• Partner with account managers, product marketing, and technical experts to create application-specific presentations showcasing GlobalFoundries technology solutions.
• Collaborate with account management teams to merge technical and commercial terms into design-winning proposals.
• Identify and resolve technical issues and concerns to convert design wins (DWIN) into product tapeouts.
• Perform all activities in a safe manner in support of Environmental, Health, Safety & Security requirements.

What you'll need

• Bachelor's or Master's degree in Electrical Engineering or an equivalent discipline (such as applied physics).
• Minimum 15 years of experience in semiconductor design, tapeout, and process.
• Working knowledge of IC chip design flows and tools from architectural definition through performance characterization for BCD and GaN technologies.
• Technical program management capabilities and problem-solving skills.
• Willingness and ability to travel up to 20%, primarily domestic with some international travel.
• Fluency in written and verbal English.

Nice to have

• Master's or PhD in Electrical Engineering or equivalent.
• 5 years of experience in semiconductor product design at the chip or module level.
• Direct experience in IC chip design flows and EDA tools from architectural definition through performance characterization.
• Exposure or experience in one or more of Digital, Analog Mixed Signal, HV Power, eNVM, Millimetre Wave, or Silicon Photonics IC product design, or SoC product integration/design.
• Demonstrated expertise in business development within the Defense Industrial Base or related government agencies.
• Project management skills with the ability to execute solutions and navigate ambiguity.

Skills: Power GaN & BCD, IC chip design flows, customer technical needs, GF technology solutions, DWIN into product Tapeout

More semiconductor jobs: GlobalFoundries jobs · Field applications engineer jobs · Richardson jobs