Yield Development Engineer - Arizona, Phoenix, United States
$133,800 - $188,890 USD yearly
Originally posted 4 June 2026 by the employer. Relisted by the employer on 2 October 2026.
About the role
Deliver analytical insights and drive yield improvement activities to minimize defects in BU and BE segments.
What you'll do
- Perform detailed analysis to monitor inline yield and identify root causes of defect and yield issues using statistical and data mining tools. - Identify excursionary or baseline sources of defects or yield impacts and recommend or lead corrective actions and fixes. - Lead and participate in continuous improvement projects on products and processes for improved performance. - Provide technical expertise on process flow segments. - Lead and participate in multi-area problem-solving teams to troubleshoot complex yield problems.
What you'll need
- Bachelor's degree in Materials Science and Engineering, Mechanical Engineering, Computer Science, Information Systems, Chemical Engineering, Electrical Engineering, Physics, or Chemistry with 4+ years of hands-on experience in yield analysis, OR a Master's degree with 3+ years of experience, OR a Ph.D. with no prior professional experience. - Experience with engineering analysis tools and scripting methods, including Python, JMP, and SQL. - Experience analyzing big data and performing commonality analysis using data science libraries and dashboard creation. - Experience with root cause analysis and model-based problem solving.
Nice to have
- Experience in yield, integration, LYA (Layout Yield Analysis), FA (Failure Analysis), test, sort, defect metrology, or QNR. - Experience leading cross-functional teams to solve yield-related challenges. - Familiarity with wafer-level or package assembly processes or substrate process flow, including process flow, tools, and yield issues. - Familiarity with semiconductor manufacturing processes and logic or substrate process flows required for yield analysis.
This role has been open 163 days — well above the 59-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
302
|
Median days open
59 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Intel Corporation | All employers we track in this specialty (302 roles · 59 employers) |
|---|---|---|
| Open roles in this specialty | 20 | 302 |
| Open roles in the wider Process, Fab & Equipment family | 192 | 10039 · 106 employers |
| Median days open | 28 d | 59 d (−31 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Who's hiring in this category
- KLA Corporation · 42 open roles · median 135 d
- Micron Technology · 40 open roles · median 41 d
- Renesas Electronics · 21 open roles · median 45 d
- Intel Corporation (this employer) · 20 open roles · median 27 d
- GlobalFoundries · 14 open roles · median 67 d
- Lumilens · 13 open roles · median 78 d
How we counted: 302 open Packaging Engineering (Advanced Packaging) roles from 59 employers tracked in the SemiconductorJobs index, counted 24 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.