Thermal Engineer-Data Center AI GPU Thermal Design - TX, Austin, United States
Originally posted 30 July 2026 by the employer.
Join the team that owns the end-to-end thermal architecture, validation, and deployment of AMD's MI Series AI accelerators.
About the role
This role involves the end-to-end thermal architecture, validation, and deployment of AMD's MI Series AI accelerators and data center GPU platforms. Engineers on this team work at the intersection of AI hardware, cooling technologies, and data center infrastructure.
What you'll do
- Design and develop thermal solutions supporting AMD's data center GPU and AI accelerator products.
- Collaborate with silicon, board, power, validation, manufacturing, and platform engineering teams to deliver thermal-mechanical solutions.
- Perform thermal validation activities including test planning, laboratory experimentation, data collection, and analysis.
- Contribute to thermal modeling and simulation efforts to support product development and design optimization.
- Investigate, evaluate, and advance emerging cooling technologies aligned with AMD's product roadmap.
- Support product development activities from concept through commercialization and mass production.
What you'll need
- Background in heat transfer, fluid dynamics, and electronics cooling technologies.
- Experience with thermal management solutions for high-performance computing, data center, server, or AI hardware environments.
- Experience using CFD tools such as Icepak, ANSYS AEDT, or similar simulation platforms.
- Knowledge of air-cooled and liquid-cooled thermal design methodologies.
- Experience with thermal laboratory testing, design of experiments (DOE), instrumentation, data acquisition, and data analysis.
- Master's degree or PhD in Mechanical Engineering.
Nice to have
- Experience developing liquid cooling solutions including cold plates, liquid interconnects, manifolds, and related cooling technologies.
- Familiarity with thermal design components such as thermal interface materials (TIMs), heat spreaders, heat sinks, vapor chambers, heat pipes, and fans.
- Experience with CAD tools such as SolidWorks or Creo.
- Exposure to scripting, automation, or data analysis tools including Python, MATLAB, C/C++, or similar languages.
- Internship, research, or industry experience related to data center infrastructure, semiconductor products, AI accelerators, GPUs, or hyperscale computing environments.
- Advanced degrees in Aerospace Engineering, Chemical Engineering, Thermal Sciences, Fluid Mechanics, or related engineering disciplines with a strong thermal focus.
- Research focused on thermal management, fluid dynamics, electronics cooling, computational modeling, or related areas.
This role has been open 80 days — well above the 51-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
963
|
Median days open
51 d
|
Median salary
$156k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | AMD | All employers we track in this specialty (963 roles · 102 employers) |
|---|---|---|
| Open roles in this specialty | 47 | 963 |
| Open roles in the wider Software, Firmware & Systems family | 406 | 6118 · 145 employers |
| Median days open | 50 d | 51 d (−1 d vs this employer) |
| Median salary (USD postings) | — | $156k |
Who's hiring in this category
- Intel Corporation · 73 open roles · median 36 d
- KLA Corporation · 65 open roles · median 44 d
- Teradyne · 57 open roles · median 30 d
- NVIDIA · 51 open roles · median 68 d
- Applied Materials · 50 open roles · median 66 d
- AMD (this employer) · 47 open roles · median 50 d
How we counted: 963 open Hardware Systems Engineering (AI ML Hardware) roles from 102 employers tracked in the SemiconductorJobs index, counted 18 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.