Technical Project/Program Management Director - Advanced Packaging - Santa Clara, CA, United States

Originally posted 4 June 2026 by the employer.

Lead cross-functional capability development and interconnect scaling initiatives for advanced packaging technologies.

About the role

Technical program expert providing oversight from conception and planning to implementation for new capability development in advanced packaging technologies, including interconnect scaling initiatives. Ensures strategies, processes, and resources are aligned to program objectives, budgets, and release schedules.

What you'll do

- Define and drive program scope and objectives based on customer requirements, specifications, or internal product and technology roadmap initiatives. - Manage long range schedule and task details utilizing project management tools such as reports, tracking charts, checklists, and project scheduling software. - Drive allocated resources across organizations to achieve on-time and within-budget performance objectives, including initiating and managing capital allocation requests, purchase requisitions, and purchase orders. - Work with senior business group management to ensure alignment with business unit strategy, including the development of advanced packaging solutions and scaling roadmaps. - Lead multifunctional teams across internal and external stakeholders to execute complex programs, providing technical and operational leadership to achieve program milestones. - Apply engineering and business process expertise to resolve complex cross-functional challenges in process integration, capability readiness, and system-level performance.

What you'll need

- Master's Degree in an engineering or related technical discipline. - 10+ years of relevant experience in technical program management or advanced packaging engineering. - Broad and comprehensive understanding of advanced packaging systems, capability development, and integration challenges. - Demonstrated experience leading cross-functional initiatives in process integration, capability readiness, and system-level performance. - Willingness and ability to travel up to 50% of the time.

Skills: advanced packaging, interconnect scaling, program objectives, process integration, capability readiness