Technical Program Manager - SoC Programs

About the role

This role involves technical program management at the intersection of silicon, supply chain, and customer success, owning the operational thread from strategic initiatives to silicon and customer delivery.

What you'll do

• Manage customer engagements end-to-end, from architectural specification alignment through tape-out, KGD testing, packaging, and volume shipment.
• Ensure alignment with ecosystem partners, including foundries, OSAT/packaging houses, EDA vendors (Synopsys, Cadence), and IP partners.
• Translate customer requirements (silicon architecture, interface specifications, package form factor, delivery schedules) into internal program plans.
• Build and maintain program trackers, risk registers, and executive dashboards covering each engagement.
• Drive gate reviews and weekly program syncs across internal RTL/DV, physical design, and validation teams.
• Identify and escalate risks early; propose and implement mitigations before they become schedule threats.

What you'll need

• 15+ years of technical program or project management experience in semiconductor, custom silicon, or chiplet/advanced packaging environments.
• Direct experience interfacing with ecosystem partners, including chip development schedules, interdependencies on EDA and IP, tape-out schedules, and silicon bring-up timelines.
• Familiarity with silicon fabrication and advanced packaging formats: CoWoS, InFO, 2.5D/3D integration, substrate/interposer-based assembly.
• Technical fluency in SoC or chiplet design flows to understand RTL milestones, DV sign-off, PD handoffs, and silicon bring-up phases.
• Proficiency with program tracking tools (and spreadsheet-based trackers).

Nice to have

• Familiarity with key connectivity IPs UCIe, PCIe Gen 5/6/7+, or high-bandwidth D2D interconnect standards.
• Prior experience at a chiplet startup, merchant silicon company, or systems company.
• Background in AI/ML infrastructure silicon — accelerators, network switches, CPO-enabled platforms.
• Familiarity with IVR/PMIC integration challenges in advanced packaging.
• Exposure to EDA infrastructure programs (SNPS/CDNS cloud flows).

Skills: program management, SoC, chiplet, advanced packaging, tape-out

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