[Summer 2027] TSMC AZ Internship Opportunities - Engineering Roles - USA-Arizona, United States
Originally posted 6 May 2026 by the employer.
About the role
Engineering internship opportunities at TSMC Arizona cover core manufacturing, equipment, integration, yield, and automation functions across fab operations.
What you'll do
- Analyze inline and end-of-line electrical or defect data to evaluate manufacturing variations and resolve yield-limiting mechanisms. - Support unit process optimization across CMP, CVD, PVD, EPI, DIF, WET, ME, Etch, or LIT through experimental design and statistical process control. - Troubleshoot alarms, install and qualify new semiconductor manufacturing tools, and maintain tool uptime within cleanroom environments. - Work on dispatching, automated material handling systems (AMHS), smart scheduling, or CIM DevOps monitoring using Prometheus, Grafana, and Kubernetes. - Perform product engineering layout analyses, failure analyses, or quality management evaluations to support process stability and production ramps.
What you'll need
- Current enrollment in an accredited Bachelor, Master, or Ph.D. degree program in Electrical Engineering, Material Science, Chemical Engineering, Chemistry, Mechanical Engineering, Physics, Industrial Engineering, Civil Engineering, Construction, or related engineering fields. - Availability to work full-time for 10 weeks (40 hours per week) on-site at the Phoenix, AZ location during summer 2027 schedules (semester or quarter system dates). - Legal eligibility to work in the United States. - Ability to meet physical fab requirements where applicable, including cleanroom gowning and lifting in accordance with NIOSH recommendations.
This role has been open 163 days — well above the 62-day median for Process Integration roles.
Process Integration · Advanced Packaging
|
Open roles in category
88
|
Median days open
62 d
|
Median salary
$182k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | TSMC Arizona | All employers we track in this specialty (88 roles · 21 employers) |
|---|---|---|
| Open roles in this specialty | 1 | 88 |
| Open roles in the wider Process, Fab & Equipment family | 92 | 10039 · 106 employers |
| Median days open | 163 d | 62 d (+101 d vs this employer) |
| Median salary (USD postings) | — | $182k |
Who's hiring in this category
- Micron Technology · 18 open roles · median 38 d
- SkyWater Technology · 13 open roles · median 3 d
- GlobalFoundries · 11 open roles · median 123 d
- Intel Corporation · 9 open roles · median 74 d
- Applied Materials · 8 open roles · median 37 d
- Renesas Electronics · 7 open roles · median 39 d
How we counted: 88 open Process Integration (Advanced Packaging) roles from 21 employers tracked in the SemiconductorJobs index, counted 24 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.
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