Microelectronics Packaging Characterization & Diagnostics Engineer - Kissimmee, FL 34744, USA
Originally posted 20 October 2026 by the employer.
Work on advanced packaging integration across Si interposer, FanOut, and hybrid bonding processes for quantum and superconducting devices.
About the role
This role is responsible for advanced packaging development, characterization, and process troubleshooting at SkyWater Technology's Florida site. The work focuses on wafer finishing, wafer level assembly, substrate assembly, superconducting materials, and quantum assembly across Si interposer, FanOut, and hybrid bonding processes.
What you'll do
- Support prototype build schedules and wafer deliverables utilizing Si interposer, FanOut, and hybrid bonding manufacturing processes incorporating superconducting and non-superconducting materials. - Support integration engineers in characterizing prototypes, extracting critical physical design information, and utilizing metrology, test, and electrical analysis tools to identify root causes of defects. - Coordinate failure analysis across internal and external laboratories, interpret results, and review, interpret, and direct FEA needs. - Identify features and packaging gaps requiring development, leading task forces to address root causes and maintain product deliverables. - Investigate and execute integration changes for yield and device performance improvements across MEMS, Photonics, High Performance Computing, CMOS, Memory, AI, and Quantum devices. - Create training documents and write technical papers detailing processes and tool set interdependencies.
What you'll need
- BS in Engineering (MS or PhD preferred). - 12+ years of Process Development & Integration Engineering experience in an Advanced Packaging Fab environment (Class 10K and 1K cleanrooms) focused on FanOut wafer level assembly, Quantum, Si Interposer, and Hybrid Bonding. - Hands-on knowledge and experience with Advanced Packaging Fab processing tools. - Integration and device knowledge spanning MEMS, Photonic, HPC, AI, ASIC, or Quantum applications. - Working knowledge of DOE, SPC, and 6-sigma concepts and applications. - US Citizenship and the ability to obtain a government security clearance.
Nice to have
- Project Management skills and/or defined training.
This role has been open 2 days — well below the 61-day median for Process Integration roles.
Process Integration · Advanced Packaging
|
Open roles in category
86
|
Median days open
61 d
|
Median salary
$187k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | SkyWater Technology | All employers we track in this specialty (86 roles · 21 employers) |
|---|---|---|
| Open roles in this specialty | 12 | 86 |
| Open roles in the wider Process, Fab & Equipment family | 86 | 10073 · 106 employers |
| Median days open | 2 d | 61 d (−59 d vs this employer) |
| Median salary (USD postings) | — | $187k |
Who's hiring in this category
- Micron Technology · 18 open roles · median 37 d
- SkyWater Technology (this employer) · 12 open roles · median 2 d
- GlobalFoundries · 11 open roles · median 122 d
- Applied Materials · 8 open roles · median 36 d
- Intel Corporation · 8 open roles · median 83 d
- Renesas Electronics · 7 open roles · median 38 d
How we counted: 86 open Process Integration (Advanced Packaging) roles from 21 employers tracked in the SemiconductorJobs index, counted 23 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.