Staff Program Manager - Advanced Packaging Technology - USA-CA Irvine Alton Parkway Bldg 2, United States
$109,700 - $175,500 USD yearly
Originally posted 15 June 2026 by the employer.
About the role
The Staff Program Manager manages large-scale advanced packaging manufacturing projects across the entire lifecycle, from greenfield factory construction and tool procurement through to production ramp. The role focuses on technologies including heterogeneous integration, substrates, and co-packaged optics.
What you'll do
- Coordinate greenfield construction of advanced packaging manufacturing facilities, managing EPC contractors, cleanroom construction, and facility hook-up. - Direct tool selection, procurement, international logistics, installation, and initial hardware qualification for manufacturing lines. - Facilitate technology transfer from R&D into high-volume manufacturing (HVM) to achieve on-time technology qualification. - Partner with factory, R&D, and tool vendors to drive operational transition from tool qualification to HVM readiness while monitoring defect-density metrics. - Manage manufacturing cycle time, line balancing, and factory automation deployment during ramp phases. - Manage multi-billion-dollar CapEx and OpEx budgets and cash flows in collaboration with finance teams.
What you'll need
- Master’s degree in Engineering, Materials Science, or a related STEM field. - 6+ years managing very large projects, with explicit experience in greenfield factory construction and factory ramps. - Deep technical understanding of advanced packaging and semiconductor manufacturing technologies, including Heterogeneous Integration, Substrates, and Co-packaged Optics. - Proven track record transitioning a semiconductor facility from construction to high-volume production, with knowledge of delivering large-scale offshore industrial projects. - PMP, PgMP, or equivalent senior-level project management credentials. - Practical understanding of factory physics, statistical process control (SPC), yield management, Lean manufacturing, and enterprise scheduling tools (Primavera P6, MS Project).
Nice to have
- MBA degree.
This role has been open 130 days — well above the 59-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
305
|
Median days open
59 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Broadcom | All employers we track in this specialty (305 roles · 59 employers) |
|---|---|---|
| Open roles in this specialty | 3 | 305 |
| Open roles in the wider Process, Fab & Equipment family | 40 | 10080 · 106 employers |
| Median days open | 142 d | 59 d (+83 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Who's hiring in this category
- KLA Corporation · 44 open roles · median 134 d
- Micron Technology · 40 open roles · median 43 d
- Renesas Electronics · 21 open roles · median 44 d
- Intel Corporation · 19 open roles · median 29 d
- GlobalFoundries · 14 open roles · median 66 d
- Lumilens · 13 open roles · median 77 d
How we counted: 305 open Packaging Engineering (Advanced Packaging) roles from 59 employers tracked in the SemiconductorJobs index, counted 23 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.