Staff Process Engineer - Bayan Lepas, my, Malaysia
Originally posted 6 October 2026 by the employer.
PQFN packages
About the role
This role involves qualifying, sustaining, and improving processes for Power QFN packages and Cu Clip related thin die assembly processes.
What you'll do
- Design packages and develop processes to qualify PQFN packages for SPS products and associated modules.
- Ramp up manufacturing volume and qualify required sources.
- Improve assembly yield, capacity, quality, and costs.
- Address internal and external customer feedback and issues by collaborating with Test/Product Engineers, Quality, and Operations.
- Manage Product Lifecycle Management documents.
- Serve as the key manufacturing engineering interface for NPI-to-production transfers.
- Manage OSAT and contract manufacturing relationships.
What you'll need
- Degree in Mechanical, Material, Physics, Chemistry, or Applied Sciences.
- Minimum 5 years of experience in Assembly Engineering.
- Experience in process engineering or package development of material/process/design of thin wafer handling and SPS solder attach processes.
- Knowledge in quality/reliability requirements of PQFNs/QFNs/WLCSP and leaded packages.
- Knowledge of wire bonding.
- Knowledge of SPC and statistical analysis software (such as JMP).
- Strong analytical, written communication, and presentation skills.
Nice to have
- Experience with Cu Clip, Thin Die, Power QFN.
- Package development knowledge.
- Experience transitioning products from Development to Production.
- Experience supporting NPI to Mass Production.
Skills: PQFN packages, process development, assembly yield, OSAT, wire bonding
This role has been open 0 days — well below the 61-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
196
|
Median days open
61 d
|
Median salary
$161k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Renesas Electronics | All employers we track in this specialty (196 roles · 44 employers) |
|---|---|---|
| Open roles in this specialty | 24 | 196 |
| Open roles in the wider Process, Fab & Equipment family | 194 | 9631 · 109 employers |
| Median days open | 38 d | 61 d (−23 d vs this employer) |
| Median salary (USD postings) | — | $161k |
Skills observed across this category: PQFN packages, process development, assembly yield, OSAT, wire bonding
Who's hiring in this category
- Infineon Technologies · 25 open roles · median 47 d
- Renesas Electronics (this employer) · 22 open roles · median 37 d
- Micron Technology · 20 open roles · median 143 d
- onsemi · 13 open roles · median 20 d
- Monolithic Power Systems · 11 open roles · median 200 d
- Intel Corporation · 9 open roles · median 161 d
How we counted: 196 open Packaging Engineering (Packaging) roles from 44 employers tracked in the SemiconductorJobs index, counted 6 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.