Package Development Engineer - TH
Originally posted 29 September 2026 by the employer.
Join SiTime to focus on QFN/LGA assembly technologies.
About the role
This role involves developing, optimizing, and sustaining advanced packaging processes to ensure high-quality and high-yield manufacturing.
What you'll do
- Develop, optimize, and characterize packaging processes for QFN and LGA technologies, including wafer thinning, dicing, and flip-chip bonding processes.
- Conduct process capability analysis (Cp/Cpk), implement statistical process control (SPC), and drive continuous improvement initiatives.
- Perform root cause analysis and implement corrective and preventive actions (8D methodology) for process-related issues.
- Collaborate with R&D, design, equipment, and manufacturing teams to ensure seamless process transfer.
- Define and maintain process specifications, control plans, and standard operating procedures (SOPs).
- Evaluate and qualify new materials, equipment, and processes to support technology roadmaps and production requirements.
What you'll need
- Bachelor, Master, or PhD degree in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, or a related discipline.
- Minimum of 5 years of experience in semiconductor packaging process engineering with strong knowledge of QFN/LGA and Flip-chip bonding technologies.
- In-depth understanding of packaging process flows, equipment, and materials (e.g., photoresists, polymers, solders, underfills).
- Proficiency in statistical analysis software (e.g., JMP, Minitab) and data interpretation.
- Experience with failure analysis techniques (e.g., SEM, EDX, Optical Microscopy, X-ray).
- Fluency in English.
This role has been open 6 days — well below the 60-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
311
|
Median days open
60 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | SiTime | All employers we track in this specialty (311 roles · 59 employers) |
|---|---|---|
| Open roles in this specialty | 4 | 311 |
| Open roles in the wider Process, Fab & Equipment family | 18 | 9631 · 109 employers |
| Median days open | 31 d | 60 d (−29 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Who's hiring in this category
- KLA Corporation · 52 open roles · median 117 d
- Micron Technology · 36 open roles · median 38 d
- Renesas Electronics · 21 open roles · median 36 d
- Infineon Technologies · 17 open roles · median 54 d
- onsemi · 15 open roles · median 27 d
- GlobalFoundries · 13 open roles · median 69 d
How we counted: 311 open Packaging Engineering (Advanced Packaging) roles from 59 employers tracked in the SemiconductorJobs index, counted 6 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.