Staff Module Design Engineer - Richardson, TX, United States
Originally posted 1 October 2026 by the employer.
This role involves developing RF/Microwave module/packaged products with integrated GaN, GaAs, or Silicon MMICs.
About the role
This role is for a Staff Electrical Module/Packaging Design Engineer responsible for the development of innovative RF/Microwave module/packaged products. This involves the design and development of single or multi-chip modules that integrate GaN, GaAs, or Silicon-based MMICs in advanced packaging technologies.
What you'll do
- Contribute to RF/mm-wave single or multi-chip module (MCM) based product development.
- Integrate MMICs into air cavity or over-molded modules.
- Perform advanced package design using 2.5D and 3D electromagnetic simulators.
- Conduct product checkout, optimization, and design verification testing (DVT) in the test lab.
- Execute DVT analysis and present results to internal and external customers.
- Support products through critical lifecycle stages including concept/feasibility, development, qualification, and production.
What you'll need
- Experience integrating microwave/millimeter-wave MMIC dies such as amplifiers, switches, phase shifters, attenuators in single or multichip air-cavity or over-mold transmit/receive front-end modules (FEMs).
- Expert-level user in 3D EM simulation tools such as HFSS and/or Analyst.
- Knowledge of ADS, Microwave Office (MWO), or Cadence (Spectre) circuit simulators.
- Expertise in analyzing performance tradeoffs of FEMs using various package types such as AC/OVM QFN, laminates, FCBGA, LGA.
- Strong understanding of electromagnetic theory and RF fundamentals such as s-parameters, impedance matching, transmission lines, and design of passive structures such as couplers.
- Hands-on experience in microwave measurements, characterization, and calibration methods.
- Knowledge of advanced semiconductor technologies such as GaN, GaAs, and/or Silicon.
- Broad knowledge of semiconductor RF / power packaging, materials, and assembly processes supporting infrastructure and defense electronic assemblies and sub-assemblies.
- BS Electrical Engineering with 8+ years of experience OR MS Electrical Engineering with 5+ years of experience OR PhD Electrical Engineering (with RF/Microwave focus) with 3+ years of relevant experience.
Nice to have
- Knowledge of RF signal chain and system analysis.
- Knowledge of antenna design.
- Published author in technical journals and/or magazines.
This role has been open 0 days — well below the 48-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
886
|
Median days open
48 d
|
Median salary
$159k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | QORVO | All employers we track in this specialty (886 roles · 103 employers) |
|---|---|---|
| Open roles in this specialty | 10 | 886 |
| Open roles in the wider Software, Firmware & Systems family | 28 | 5964 · 145 employers |
| Median days open | 31 d | 48 d (−17 d vs this employer) |
| Median salary (USD postings) | — | $159k |
Who's hiring in this category
- Intel Corporation · 62 open roles · median 27 d
- NVIDIA · 55 open roles · median 55 d
- KLA Corporation · 53 open roles · median 33 d
- Teradyne · 48 open roles · median 13 d
- Applied Materials · 45 open roles · median 58 d
- AMD · 40 open roles · median 53 d
How we counted: 886 open Hardware Systems Engineering (AI ML Hardware) roles from 103 employers tracked in the SemiconductorJobs index, counted 1 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.