Staff Mechanical & Thermal Simulation Engineer - Pune
Digital Design & SoC Architecture
About the role
This role involves performing thermal and structural simulation and mechanical design of power converters, specifically supporting Navitas Semiconductor's high-voltage SiC product portfolio.
What you'll do
- Perform system-level thermal simulations of power converters and semiconductor assemblies using ANSYS (Icepak, Fluent, Mechanical/Workbench), covering conduction, convection and radiation with forced-air and liquid cooling.
- Build electro-thermal models of SiC MOSFET-based converters, including power-loss maps, junction and case temperature estimation, and defining thermal derating and cooling margins.
- Own the mechanical design of power converters and reference designs (enclosures, heatsinks, cold plates, busbars, magnetics mounting, connectors, fasteners) with attention to creepage/clearance and high-voltage isolation requirements for systems up to 10 kV.
- Create 3D CAD models and 2D manufacturing drawings (SolidWorks, Creo or similar) with GD&T and tolerance stack-up analysis for converter assemblies, evaluation (EVAL) boards and test fixtures.
- Perform structural, shock and vibration analysis of converter assemblies and support compliance with relevant industrial and automotive standards.
- Conduct hands-on thermal validation in the lab using thermocouples, IR imaging and airflow/pressure measurements, and correlate simulation models against measured data.
What you'll need
- 5+ years of hands-on experience in thermal and mechanical design for power electronics.
- Degree in Mechanical Engineering or a related field.
- Proficiency with ANSYS simulation tools (Icepak, Fluent, Mechanical/Workbench) for CFD, thermal and structural analysis.
- Strong 3D CAD skills (SolidWorks, Creo or similar), including 2D drawings, GD&T and tolerance analysis.
- Solid understanding of power semiconductor thermal management: TIMs, heatsinks, cold plates, fans, liquid cooling and package thermal paths.
- Hands-on thermal validation experience (thermocouples, IR cameras, airflow measurement) and model-to-measurement correlation.
Nice to have
- Experience with electro-thermal co-simulation.
- Experience with shock/vibration analysis and environmental testing.
- Proven experience in system-level thermal simulation of power converters using ANSYS.
- Strong knowledge of thermal management and mechanical packaging for server and AI data center power systems.
Market context
This role has been open 0 days — well below the 46-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
805
|
Median days open
46 d
|
Median salary
$159k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Navitas Semiconductor | All employers we track in this specialty (805 roles · 101 employers) |
|---|---|---|
| Open roles in this specialty | 2 | 805 |
| Open roles in the wider Software, Firmware & Systems family | 3 | 5735 · 146 employers |
| Median days open | 14 d | 46 d (−32 d vs this employer) |
| Median salary (USD postings) | — | $159k |
Who's hiring in this category
- NVIDIA · 55 open roles · median 57 d
- Intel Corporation · 47 open roles · median 19 d
- KLA Corporation · 47 open roles · median 40 d
- AMD · 43 open roles · median 54 d
- Applied Materials · 43 open roles · median 55 d
- Qualcomm · 38 open roles · median 39 d
How we counted: 805 open Hardware Systems Engineering (AI ML Hardware) roles from 101 employers tracked in the SemiconductorJobs index, counted 16 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.