Staff HIG ESD and Latch-up Engineer- HBM - TPG - United States
$181,000 - $308,000 USD yearly
Originally posted 16 September 2026 by the employer.
About the role
This role ensures the reliability of Micron's advanced DRAM and HBM products by defining and owning chip-level and IP-level ESD and latch up strategies. The position focuses on enabling ESD protection circuits and latch up safe layout practices across designs and technologies for HBM solutions that power AI and machine learning.
What you'll do
- Define and own chip-level and IP-level ESD and latch up strategies for HBM DRAM, base die, I/O, TSVs, and die-to-die interfaces.
- Establish ESD and latch up requirements, targets, and sign-off criteria aligned with JEDEC/ESDA standards.
- Enable ESD protection circuits and latch up safe layout practices across designs and technologies.
- Lead silicon validation, failure analysis, and correlation of pre-silicon assumptions to silicon results.
- Act as the technical interface to foundries and partner with design, packaging, reliability, and product teams.
What you'll need
- Master’s degree or Ph.D. in Electrical Engineering or equivalent industry experience.
- Strong fundamentals in ESD physics, latch up mechanisms, and advanced CMOS devices.
- Hands-on experience with ESD protection circuits and latch up prevention techniques.
- Familiarity with JEDEC and ESDA standards, including HBM, CDM, and JESD78.
Nice to have
- Experience supporting ESD and latch up sign-off for advanced DRAM or HBM products.
- Knowledge of SCR-based clamps, distributed ESD networks, and rail-based strategies.
- Experience working directly with foundry ESD and latch up teams.
- Proven ability to mentor engineers and influence design methodology across teams.
Skills: ESD, latch up, HBM DRAM, JEDEC/ESDA standards, silicon validation
This role has been open 18 days — well below the 69-day median for Memory Design roles.
Memory Design · Memory Design
|
Open roles in category
287
|
Median days open
69 d
|
Median salary
$205k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Micron Technology | All employers we track in this specialty (287 roles · 29 employers) |
|---|---|---|
| Open roles in this specialty | 153 | 287 |
| Median days open | 86 d | 69 d (+17 d vs this employer) |
| Median salary (USD postings) | — | $205k |
Skills observed across this category: ESD, latch up, HBM DRAM, JEDEC/ESDA standards, silicon validation
Who's hiring in this category
- Micron Technology (this employer) · 151 open roles · median 86 d
- Synopsys · 27 open roles · median 49 d
- SanDisk · 17 open roles · median 32 d
- Broadcom · 16 open roles · median 50 d
- Qualcomm · 12 open roles · median 149 d
- NVIDIA · 7 open roles · median 59 d
How we counted: 287 open Memory Design (Memory Design) roles from 29 employers tracked in the SemiconductorJobs index, counted 5 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.