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Qualcomm

Staff Engineer, RMA

Qualcomm San Diego, California, United States of America, United States 1 month ago
Product Engineering & Quality

$128,000 - $192,000 USD yearly

Originally posted 10 September 2026 by the employer.

Advance product quality as a Staff Engineer, RMA in Qualcomm's Customer Quality Team.

About the role

As a Staff Engineer, RMA, you will resolve product quality issues associated with Return Merchandise Authorization (RMA) requests by performing system- and device-level evaluations.

What you'll do

  • Lead major customer issues to resolution, reducing occurrences of No Fault Found, EOS, ESD, Mechanical damage, and SMT Reflow.
  • Conduct technical evaluations of customer returned devices using tools such as ATE, XRAY, CSAM, IV curve analysis, and bench testing to determine root cause.
  • Act as the conduit between Qualcomm's customer, Product Core Team, and Branch CQE, and improve processes as needed.
  • Track actions, schedules, and owners to maintain targeted RMA analysis cycle time and initiate internal corrective actions.
  • Drive improvement of internal quality systems to reduce outgoing product quality DPPM.
  • Update customers in a timely fashion regarding the status of open quality issues or support requests.

What you'll need

  • Bachelor's degree in Engineering, Material Science, Computer Science, or a related field and 4+ years of Reliability Engineering experience.
  • Experience in a technical leadership role.
  • Experience with digital SoC products, semiconductor technologies, and system-level debugging.
  • Experience analyzing and debugging customer issues involving application processors, CPUs, GPUs, DSPs, AI/NPU subsystems, memory, power management, and modem technologies (e.g., LTE, WCDMA, CDMA, GSM).
  • Experience in microelectronics, SMT processes, semiconductor fabrication, assembly, and product quality engineering.
  • Strong experience with quality methodologies, statistical analysis, root-cause investigation, and structured problem-solving techniques.

Nice to have

  • Strong understanding of Digital SoC architecture, including CPU, GPU, DSP, NPU/AI accelerators, cache hierarchy, memory subsystems, interconnects, power management, and clocking architectures.
  • Experience debugging complex SoC-level failures, including boot issues, system hangs, crashes, performance degradation, thermal events, and power-related failures.
  • Strong knowledge of silicon debug methodologies, failure analysis, fault isolation, and root cause determination for digital semiconductor products.
  • Experience with hardware/software interaction, including firmware, bootloaders, operating systems, device drivers, and application-level debugging.
  • Familiarity with power management features such as DVFS, CPR, low-power modes, voltage scaling, and thermal management.
  • Experience analyzing customer-reported issues involving CPU, GPU, DSP, AI/NPU, memory (DDR/LPDDR), storage, display, camera, audio, connectivity, and modem subsystems.
  • Working knowledge of semiconductor manufacturing, assembly, package reliability, SMT processes, and failure mechanisms such as EOS, ESD, latch-up, and mechanical damage.
  • Experience using debug and characterization tools such as ATE, JTAG, scan diagnostics, logic analyzers, oscilloscopes, protocol analyzers, X-ray, CSAM, IV curve tracing, and FA tools.
  • Strong understanding of silicon validation, product qualification, yield analysis, reliability testing, and customer-return failure analysis methodologies.
  • Proven ability to lead cross-functional debug efforts involving Design, Product Test Engineering, Failure Analysis, Manufacturing, Reliability, System Engineering, and Software teams.
  • Strong understanding of smartphone and embedded system architectures, including application processors, memory subsystems, power delivery networks, display, camera, audio, storage, and connectivity functions.
  • Ability to correlate customer-reported failure symptoms with underlying SoC, hardware, software, or manufacturing-related root causes.
  • Experience with Android-based systems, system logs, crash analysis, kernel debugging, and performance characterization.

Skills: RMA, technical evaluations, root cause, ATE, XRAY, CSAM, IV curve, silicon debug

Market context

This role has been open 34 days — well below the 49-day median for Failure Analysis Engineering roles.

Failure Analysis Engineering · Failure Analysis

Open roles in category
193
Median days open
49 d
Median salary
$115k
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
How Qualcomm compares in Failure Analysis Engineering hiring
Metric Qualcomm All employers we track in this specialty (193 roles · 39 employers)
Open roles in this specialty 3 193
Open roles in the wider Process, Fab & Equipment family 50 9890 · 109 employers
Median days open 65 d 49 d (+16 d vs this employer)
Median salary (USD postings) — $115k

Skills observed across this category: RMA, technical evaluations, root cause, ATE, XRAY, CSAM

Who's hiring in this category

  • Micron Technology · 31 open roles · median 72 d
  • GlobalFoundries · 14 open roles · median 23 d
  • Lam Research · 14 open roles · median 39 d
  • Infineon Technologies · 13 open roles · median 44 d
  • Intel Corporation · 12 open roles · median 26 d
  • AMD · 9 open roles · median 83 d

How we counted: 193 open Failure Analysis Engineering (Failure Analysis) roles from 39 employers tracked in the SemiconductorJobs index, counted 15 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.

Apply now
San Diego, California, United States of America, United States
On-site
$128,000 - $192,000 USD yearly
1 month ago

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