Staff Engineer Process Development - Ipoh, Malaysia
Originally posted 30 September 2026 by the employer.
About the role
This role involves process development activities for semiconductor packaging, focusing on AOI and CDWJ processes.
What you'll do
- Perform AOI and CDWJ process development activities, including parameter optimization, verification, and freeze.
- Create or update DFMEA, PFMEA, and process specifications for AOI and CDWJ processes.
- Participate in Design Rules, Design of Manufacturing (DFM), Gap Analysis, and problem solving.
- Participate in and contribute to the generation of new ideas or new packaging technology.
- Responsible for technical handshake and knowledge transfer from development to operation.
- Support engineering and qual builds.
What you'll need
- At least 5 years of experience in process development.
- Degree or Master's in Mechanical or Materials Engineering.
- Process and equipment knowledge in semiconductor packaging, especially AOI/CDWJ for power packaging.
- Statistical Analysis (JMP) skills.
- Computer skills.
Skills: process development, semiconductor packaging, AOI, CDWJ, DFM
This role has been open 1 day — well below the 72-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
200
|
Median days open
72 d
|
Median salary
$163k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Wolfspeed | All employers we track in this specialty (200 roles · 43 employers) |
|---|---|---|
| Open roles in this specialty | 2 | 200 |
| Open roles in the wider Process, Fab & Equipment family | 74 | 9566 · 109 employers |
| Median days open | 1 d | 72 d (−71 d vs this employer) |
| Median salary (USD postings) | — | $163k |
Skills observed across this category: process development, semiconductor packaging, AOI, CDWJ, DFM
Who's hiring in this category
- Infineon Technologies · 26 open roles · median 43 d
- Renesas Electronics · 23 open roles · median 35 d
- Micron Technology · 17 open roles · median 149 d
- onsemi · 13 open roles · median 16 d
- Monolithic Power Systems · 11 open roles · median 196 d
- Intel Corporation · 9 open roles · median 160 d
How we counted: 200 open Packaging Engineering (Packaging) roles from 43 employers tracked in the SemiconductorJobs index, counted 2 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.