Staff Engineer, HBM Test Vehicle Design - Richardson, TX, United States
Originally posted 21 September 2026 by the employer.
This role leads the design and development of HBM test vehicles.
About the role
This role involves leading the design and development of test vehicles that enable technology learning and risk reduction for future HBM products. The position focuses on developing representative test vehicles and characterization structures to enable learning in development and engineering.
What you'll do
- Serve as a technical lead for HBM test vehicle design and structure development.
- Define and implement test structures targeting key learning areas such as package interaction and reliability.
- Drive test vehicle content definition, structure specifications, measurement requirements, and validation objectives.
- Analyze silicon characterization and qualification results to identify optimization opportunities.
- Support development of product-enveloping experimental vehicles to improve learning and enable reuse.
- Lead technical investigations to understand design, process, and package interactions.
What you'll need
- Master’s degree or PhD in Electrical Engineering, Computer Engineering, Materials Science, Physics, or related field.
- 5+ years of semiconductor experience in design, product engineering, packaging, or technology development.
- Strong understanding of semiconductor design and physical implementation fundamentals.
- Experience with silicon validation, characterization, data analysis, or failure investigation.
- Proficiency with demonstrating AI and AI-enabled development workflows.
- Proven ability to work effectively across multiple engineering organizations.
Nice to have
- Experience with HBM, DRAM, or advanced memory products.
- Experience designing test structures, test chips, characterization vehicles, or technology demonstrators.
- Knowledge of advanced packaging technologies including TSVs, hybrid bonding, and 3D integration.
- Understanding of reliability qualification methodologies and failure mechanisms.
- Experience using silicon learning to influence future design or technology decisions.
Skills: HBM test vehicle, test structures, silicon characterization, advanced packaging, TSVs, 3D integration
This role has been open 13 days — well below the 69-day median for Memory Design roles.
Memory Design · Memory Design
|
Open roles in category
287
|
Median days open
69 d
|
Median salary
$205k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Micron Technology | All employers we track in this specialty (287 roles · 29 employers) |
|---|---|---|
| Open roles in this specialty | 153 | 287 |
| Median days open | 86 d | 69 d (+17 d vs this employer) |
| Median salary (USD postings) | — | $205k |
Skills observed across this category: HBM test vehicle, test structures, silicon characterization, advanced packaging, TSVs, 3D integration
Who's hiring in this category
- Micron Technology (this employer) · 151 open roles · median 86 d
- Synopsys · 27 open roles · median 49 d
- SanDisk · 17 open roles · median 32 d
- Broadcom · 16 open roles · median 50 d
- Qualcomm · 12 open roles · median 149 d
- NVIDIA · 7 open roles · median 59 d
How we counted: 287 open Memory Design (Memory Design) roles from 29 employers tracked in the SemiconductorJobs index, counted 5 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.