Sr. FPGA Design Engineer - Milpitas, CA, United States
$141,300 - $240,200 USD yearly
Originally posted 28 May 2026 by the employer.
About the role
The Sr. FPGA Engineer architects and implements FPGA and digital designs for E-beam inspection systems within the electrical engineering team.
What you'll do
- Design, implement, and debug FPGAs and firmware for advanced E-beam systems. - Build test benches for simulation, timing analysis, timing closure, and FPGA functionality verification. - Collaborate with hardware and embedded software engineers to design FPGA firmware for mixed-signal designs. - Define FPGA firmware requirement specifications and drive projects from concept through production release. - Work with mechanical, optical, software, systems, and manufacturing engineering teams to ensure subsystem and system-level integration and test. - Author technical documentation aligned with defined quality standards.
What you'll need
- Bachelor's degree with 8 years of experience, Master's degree with 6 years of experience, or PhD with 3 years of experience. - Experience with complex FPGA firmware designs, targeting Xilinx or Intel/Altera devices. - Proficiency in hardware description languages including Verilog or SystemVerilog. - Proficiency in FPGA simulation tools such as VCS, ModelSim, or equivalent, and design suites such as Vivado. - Hands-on experience with FPGA timing analysis, timing closure, and lab test equipment including logic analyzers and oscilloscopes. - Working knowledge of interface protocols including PCIe, Aurora, DDR4, 10G, SPI, and I2C, alongside networking and embedded Linux build systems.
Nice to have
- Experience with Xilinx FPGAs.
This role has been open 149 days — well above the 59-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
302
|
Median days open
59 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | KLA Corporation | All employers we track in this specialty (302 roles · 59 employers) |
|---|---|---|
| Open roles in this specialty | 42 | 302 |
| Open roles in the wider Process, Fab & Equipment family | 511 | 10039 · 106 employers |
| Median days open | 135 d | 59 d (+76 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Who's hiring in this category
- KLA Corporation (this employer) · 42 open roles · median 135 d
- Micron Technology · 40 open roles · median 41 d
- Renesas Electronics · 21 open roles · median 45 d
- Intel Corporation · 20 open roles · median 27 d
- GlobalFoundries · 14 open roles · median 67 d
- Lumilens · 13 open roles · median 78 d
How we counted: 302 open Packaging Engineering (Advanced Packaging) roles from 59 employers tracked in the SemiconductorJobs index, counted 24 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.