$141,300 - $240,200 USD yearly
Originally posted 28 April 2026 by the employer.
About the role
This role is for a senior engineer within the Electrical Engineering group to provide technical leadership across low-noise analog to digital signal circuits. Designs support metrology and reticle inspection systems within KLA's Global Products Group.
What you'll do
- Gather project requirements, perform conceptual feasibility studies, and handle project planning, cost, and scheduling. - Execute analog and digital PCB design using CAD tools. - Conduct circuit, noise, timing, thermal/cooling, electrical loads, and FPGA analyses. - Define interfaces with critical sub-systems and collaborate with Mechanical, Optical, Software, Systems, and Manufacturing teams. - Lead design validation planning, execution, firmware integration, and system integration.
What you'll need
- Bachelor's degree with 8+ years of related work experience, Master's degree with 6+ years of experience, or Doctorate with 3+ years of experience. - Experience delivering analog and digital PCB designs. - Ability to travel occasionally up to 10%.
Nice to have
- Experience with OrCAD, PSpice, or LTSim. - Expertise in low-noise linear analog circuitry and characteristics of analog components. - Expertise in high-speed digital design, data acquisition, and signal integrity. - Experience with CCD sensors and image acquisition. - Understanding of capabilities and coding techniques of advanced FPGA devices. - Proficiency in using advanced electronics laboratory equipment.
Skills: PCBA, analog circuit design, digital circuit design, PCB layout, schematics
This role has been open 179 days — well above the 60-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
300
|
Median days open
60 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | KLA Corporation | All employers we track in this specialty (300 roles · 59 employers) |
|---|---|---|
| Open roles in this specialty | 42 | 300 |
| Open roles in the wider Process, Fab & Equipment family | 511 | 10039 · 106 employers |
| Median days open | 135 d | 60 d (+75 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Skills observed across this category: PCBA, analog circuit design, digital circuit design, PCB layout, schematics
Who's hiring in this category
- KLA Corporation (this employer) · 42 open roles · median 136 d
- Micron Technology · 40 open roles · median 42 d
- Renesas Electronics · 21 open roles · median 46 d
- Intel Corporation · 20 open roles · median 28 d
- GlobalFoundries · 14 open roles · median 68 d
- Lumilens · 13 open roles · median 79 d
How we counted: 300 open Packaging Engineering (Advanced Packaging) roles from 59 employers tracked in the SemiconductorJobs index, counted 25 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.