Sr. Director, SiC Power Module Development - Manila, Alabang, Philippines
Navitas Semiconductor is seeking a Sr. Director to lead SiC power module development.
About the role
This role involves leading the development and execution of the SiC power module technology roadmap for high-voltage and ultra-high-voltage product platforms. The position focuses on defining module architectures, design rules, material strategies, and assembly processes.
What you'll do
- Lead the development and execution of the SiC power module technology roadmap.
- Build, lead, and develop a global organization of package, module, materials, process, reliability, and manufacturing engineers.
- Drive the development of advanced power module packaging technologies from concept through production release.
- Establish module architectures, design rules, material strategies, and assembly processes.
- Own technical execution of power module development programs across all phases.
- Serve as the senior technical interface with customers, suppliers, and manufacturing partners for SiC power module technologies.
What you'll need
- M.S. or Ph.D. in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or a related technical discipline.
- 15+ years of semiconductor packaging or power module development experience with technical leadership.
- Proven experience developing and releasing power semiconductor modules from concept through production.
- Deep knowledge of power module architectures, packaging materials, assembly processes, thermal management, electrical parasitics, high-voltage isolation, and reliability engineering.
- Demonstrated experience leading module development and industrialization with OSATs or outsourced manufacturing partners.
- Strong understanding of JEDEC, AEC-Q, and relevant industrial or automotive qualification methodologies.
- Proven record of building and leading global, multidisciplinary engineering teams.
Nice to have
- SiC MOSFET power modules across 1.2kV, 1.7kV, 2.3kV, 3.3kV, and higher voltage classes.
- Ultra-high-voltage insulation design, electric-field management, creepage and clearance, and partial-discharge mitigation.
- AMB/DBC substrate technology and high-reliability substrate attachment.
- Pressureless or pressure-assisted silver sintering and advanced die-attach technologies.
- High-current wire, ribbon, and clip interconnect technologies.
- Power-module thermal management, electro-thermal modeling, power cycling, and lifetime prediction.
- Known-good-die, wafer-level burn-in, and module-level high-voltage test solutions.
- OSAT power module industrialization, second-source qualification, safe launch, and high-volume manufacturing ramp.
This role has been open 28 days — well below the 46-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
805
|
Median days open
46 d
|
Median salary
$159k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Navitas Semiconductor | All employers we track in this specialty (805 roles · 101 employers) |
|---|---|---|
| Open roles in this specialty | 2 | 805 |
| Open roles in the wider Software, Firmware & Systems family | 3 | 5735 · 146 employers |
| Median days open | 14 d | 46 d (−32 d vs this employer) |
| Median salary (USD postings) | — | $159k |
Who's hiring in this category
- NVIDIA · 55 open roles · median 57 d
- Intel Corporation · 47 open roles · median 19 d
- KLA Corporation · 47 open roles · median 40 d
- AMD · 43 open roles · median 54 d
- Applied Materials · 43 open roles · median 55 d
- Qualcomm · 38 open roles · median 39 d
How we counted: 805 open Hardware Systems Engineering (AI ML Hardware) roles from 101 employers tracked in the SemiconductorJobs index, counted 16 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.