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Microchip Technology

Senior Technical Staff Engineer-Applications

Microchip Technology Chandler, AZ, United States 3 months ago
Applications & FAE

Lead global SME teams delivering system-level guidance across Silicon Carbide (SiC), IGBTs, and Power Modules.

Originally posted 4 August 2026 by the employer.

About the role

This role provides technical and organizational leadership for the High Power Solutions (HPS) Business Unit, managing a global Subject Matter Expert (SME) team and driving customer technical engagements. The technical scope centers on Silicon Carbide (SiC), Power Modules, IGBTs, Gate Drivers, and high-power conversion system solutions.

What you'll do

  • Manage, mentor, and develop a geographically dispersed team of technical subject-matter experts within the global SME organization.
  • Drive strategic customer engagements and design wins by providing application expertise, system-level guidance, and technical escalation support for complex high-power challenges.
  • Provide recommendations on system architectures, power topologies, and component selection spanning SiC, IGBTs, Power Modules, and Gate Drivers.
  • Collaborate with Applications Engineering teams to develop evaluation boards, demonstration platforms, and reference designs.
  • Deliver technical content including application notes, white papers, presentations, and training materials for customers and internal teams.
  • Gather customer and market intelligence to provide structured feedback to Product Line Management and Product Development teams for roadmap planning.

What you'll need

  • Bachelor's degree in Electrical Engineering with at least 12.5 years of experience in Applications Engineering, Field Applications Engineering, Power Electronics Design, or System Architecture.
  • Strong technical background with high-voltage and high-power semiconductor technologies, including Silicon Carbide (SiC), IGBTs, and Power Modules.
  • Demonstrated expertise in high-voltage and high-power conversion systems, covering system architecture, power topology selection, and component integration.
  • Proficiency with PCB design tools alongside circuit- and system-level simulation tools.
  • Hands-on experience with laboratory equipment, test methodologies, and waveform analysis.
  • Experience leading cross-functional technical teams and mentoring engineers across global organizations.

Skills: customer engagements, application expertise, system-level guidance, power conversion, SiC, IGBTs

More semiconductor jobs: Microchip Technology jobs · Field applications engineer jobs · Chandler jobs

Market context

This role has been open 92 days — well above the 50-day median for Applications FAE roles.

Applications FAE · Power Conversion

Open roles in category
38
Median days open
50 d
Category median salary (all employers)
—
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
How Microchip Technology compares in Applications FAE hiring
Metric Microchip Technology All employers we track in this specialty (38 roles · 13 employers)
Open roles in this specialty 2 38
Median days open 78 d 50 d (+28 d vs this employer)
Median salary (USD postings) — —

Skills observed across this category: customer engagements, application expertise, system-level guidance, power conversion, SiC, IGBTs

Who's hiring in this category

  • Infineon Technologies · 9 open roles · median 41 d
  • Monolithic Power Systems · 7 open roles · median 76 d
  • Analog Devices · 5 open roles · median 6 d
  • onsemi · 3 open roles · median 163 d
  • Power Integrations · 3 open roles · median 94 d
  • Microchip Technology (this employer) · 2 open roles · median 77 d

How we counted: 38 open Applications FAE (Power Conversion) roles from 13 employers tracked in the SemiconductorJobs index, counted 29 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.

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Chandler, AZ, United States
On-site
3 months ago

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