Senior Technical Lead, New Product Development, SiC & Si Power Discretes/Modules - Scottsdale, AZ, United States
Originally posted 15 June 2026 by the employer.
About the role
This role serves as the Engineering Product Owner (EPO) for SiC / Si Power Discrete and/or Power Module products supporting automotive and industrial applications at onsemi. The EPO acts as the single point of product-level engineering leadership, driving cross-functional alignment across global NPD teams to meet performance, cost, reliability, and schedule targets.
What you'll do
- Own product definitions, technical requirements, and tradeoffs across performance, reliability, cost, manufacturability, and schedule for power discrete and power module products. - Evaluate and select product architectures, technologies, and packaging concepts while assessing die-to-package interactions and electrical, thermal, and reliability impacts. - Serve as the central technical leader aligning TD, PE, packaging, test, reliability, quality, supply chain, and manufacturing teams across global NPD programs. - Coordinate system-level electrical, thermal, and mechanical modeling to validate product performance and align product intent across die, package, and module implementations. - Own product-level risk identification, mitigation strategies, design reviews, program gate reviews, and NPD governance adherence. - Lead cross-functional task forces through structured root cause analysis, containment, and resolution, and deliver concise executive updates and decision-ready summaries.
What you'll need
- Master’s or Ph.D. in Electrical Engineering, Materials Science, Physics, or a related field. - 10+ years of experience in power semiconductor product development, with deep expertise in power discrete and/or module products (SiC/Si MOSFET preferred). - Deep understanding of power device physics and semiconductor fabrication processes, including device architecture, wafer processing, and fab-to-product interactions. - Strong expertise in power device and packaging fundamentals, including module and discrete packaging, electrical, thermal, and mechanical performance, die-to-package interaction, and reliability mechanisms. - Proven track record of leading product-level execution across complex global programs, influencing cross-functional teams without direct authority. - Demonstrated experience leading cross-functional task forces, resolving high-impact technical challenges with root cause analysis, and managing escalations and tradeoffs for senior leadership.
Skills: power discrete, power module products, SiC/Si MOSFET, product architectures, risk management, executive updates