Senior Staff, Technical Program Management, Power Package NPI - Tempe, United States
Originally posted 28 October 2026 by the employer.
About the role
This role leads technical program management execution for Renesas' AI/Datacenter Infrastructure Power package engineering and New Product Introduction (NPI) programs from development through production ramp. You will partner with Package Engineering leadership, Power product group teams, and global OSAT/CM partners to manage critical path, qualification, and production readiness.
What you'll do
- Establish and drive end-to-end NPI program plans, milestones, critical paths, and resource alignment across internal teams and strategic OSAT locations. - Partner with Package Engineering technical leads to manage development, qualification, and volume manufacturing transitions. - Lead cross-functional technical task forces with OSAT/CM partners and customers to resolve issues impacting quality, reliability, yield, manufacturability, and assembly. - Align OSAT development activities—including design of experiments (DOE), process optimization, and process-window verification—with program targets. - Track Engineering Build Requests (EBRs) and drive recovery plans and root-cause corrective actions through closure. - Provide concise, fact-based reporting to senior leadership regarding program health, risks, schedule recovery, and resource allocations.
What you'll need
- Bachelor’s degree or higher in Electrical, Mechanical, Chemical, or Materials Engineering, Materials Science, Physics, Chemistry, or a related technical discipline. - 12+ years of relevant experience in semiconductor engineering, package development, NPI, manufacturing, or technical program management. - Demonstrated experience managing complex semiconductor NPI programs involving package development, assembly, qualification, reliability, and manufacturing ramp. - Hands-on experience with Power Management products, such as power SiP/modules, Smart Power Stages, Vertical Power Stages, Power Modules, Discrete FET packages, battery management systems, PMICs, wafer-level, or flip-chip technologies. - Direct experience managing development and production activities with external OSATs and contract manufacturers (CMs). - Proven knowledge of SPC/statistical methods, structured problem-solving methodologies, qualification standards, and critical-path management. - Ability to travel domestically and internationally approximately 10–20% of the time, including visits to OSAT/CM sites.
Nice to have
- Experience supporting high-growth, high-visibility customer programs. - Familiarity with wide-bandgap (SiC/GaN) devices, power-module substrates (DBC/AMB), multi-chip architectures, or advanced interconnect technologies. - Experience with formal technical program management methodologies and portfolio-level governance.
Skills: NPI, Power Management, Packaging, OSAT, Program Management, Qualification