Senior Staff, Technical Program Management, Power Package NPI - Plano, United States
Originally posted 28 October 2026 by the employer.
Lead NPI and package development for AI and datacenter power SiP/modules, Smart Power Stages, and flip-chip technologies.
About the role
Lead Technical Program Management execution for strategic AI and Datacenter Infrastructure Power package engineering and New Product Introduction (NPI) programs, managing deliverables from development and qualification through production ramp. The role coordinates across Package Engineering leadership, Power product group teams, and strategic global OSAT and CM partners.
What you'll do
- Establish and drive end-to-end NPI program plans, milestones, critical paths, and resource alignment across internal teams and strategic OSAT locations. - Partner with Package Engineering leadership to provide program-level execution, governance, and accountability covering development, qualification, and transition to volume manufacturing. - Lead cross-functional technical task forces on issues impacting quality, reliability, yield, manufacturability, qualification, or schedule, driving root-cause analysis through to corrective action closure. - Direct key OSAT and CM partners through program reviews, milestone tracking, risk identification, recovery plans, and execution of Engineering Build Requests (EBRs). - Align OSAT/CM development activities—including design of experiments (DOE), process optimization, and process-window verification—with overarching NPI schedules and production-readiness reviews. - Provide fact-based communication and dashboards to senior leadership on program health, critical risks, critical paths, and resource needs.
What you'll need
- Bachelor’s degree or higher in Electrical, Mechanical, Chemical, or Materials Engineering, Materials Science, Physics, Chemistry, or a related technical discipline. - 12+ years of relevant experience in semiconductor engineering, product development, applications, package development, NPI, manufacturing, or technical program management, including managing complex cross-functional programs. - Hands-on experience with Power Management products, such as power SiP/modules, Smart Power Stages, Vertical Power Stages, Power Modules, Discrete FET packages, battery management systems, PMICs, or wafer-level and flip-chip technologies. - Direct experience managing semiconductor package development, assembly, qualification, reliability, SPC/statistical methods, and volume manufacturing ramps with OSAT/CM partners. - Demonstrated program management capabilities in critical-path management, risk mitigation, schedule recovery, and cross-functional resource alignment. - Willingness to travel domestically and internationally approximately 10–20% of the time, including to OSAT/CM sites.
Nice to have
- Familiarity with wide-bandgap (SiC/GaN) devices, power-module substrates (DBC/AMB), multi-chip modules, or advanced interconnect technologies. - Experience supporting high-growth, customer-critical NPI programs. - Experience with formal technical program management methodologies and portfolio-level governance.
Skills: NPI, Power Management, Packaging, OSAT, Program Management, Qualification