Senior Staff, Technical Program Management, Power Package NPI - Austin, United States
Originally posted 28 October 2026 by the employer.
About the role
This role leads technical program management execution for AI/Datacenter Infrastructure Power package engineering and New Product Introduction (NPI) programs from development and qualification through production ramp. You will collaborate with product TPMs, Package Engineering leadership, Power product group teams, and global OSAT/CM partners to deliver committed schedules and production readiness.
What you'll do
- Establish and drive end-to-end NPI program plans, milestones, critical paths, and resource alignment across development, qualification, and volume manufacturing. - Lead cross-functional technical task forces with internal teams and external OSAT/CM partners to resolve assembly, process-integration, quality, yield, and manufacturability issues. - Align OSAT/CM development activities—including DOE, process optimization, process-window verification, and production controls—with qualification and ramp readiness goals. - Ensure Engineering Build Requests (EBRs) execute on schedule at each OSAT while tracking critical path delays and driving recovery actions. - Establish program dashboards and management systems tracking milestones, risks, issues, action owners, and recovery plans for senior leadership. - Drive root-cause analysis, statistical process controls, and structured problem solving through to corrective and preventive action closure.
What you'll need
- Bachelor’s degree or higher in Electrical, Mechanical, Chemical, or Materials Engineering; Materials Science; Physics; Chemistry; or a related technical discipline. - 12+ years of relevant experience in semiconductor engineering, product development, package development, NPI, manufacturing, or technical program management. - Hands-on experience managing semiconductor NPI programs involving package development, assembly, qualification, reliability, and manufacturing ramp. - Direct technical background with Power Management products, such as power SiP/modules, Smart Power Stages, Vertical Power Stages, Power Modules, Discrete FET packages, battery management systems, PMICs, wafer-level, or flip-chip technologies. - Demonstrated experience partnering with OSATs/CMs to manage distributed development and production activities, including SPC and structured problem solving. - Willingness to travel domestically and internationally approximately 10–20% of the time to OSAT and CM sites.
Nice to have
- Familiarity with wide-bandgap (SiC/GaN) devices, power-module substrates (DBC/AMB), multi-chip architectures, or advanced interconnect technologies. - Experience supporting high-growth, high-visibility customer programs and driving customer-critical NPI programs. - Experience with formal technical program management methodologies and portfolio-level governance.
Skills: NPI, Power Management, Packaging, OSAT, Program Management, Qualification