Senior/ Staff Design Engineer, HBM - Richardson, TX, United States
Originally posted 15 August 2026 by the employer.
Work on High Bandwidth Memory (HBM) product design and silicon debug.
About the role
This role focuses on designing and optimizing High Bandwidth Memory (HBM) products for AI/ML, high-performance computing (HPC), and data-centric systems, collaborating across global engineering and product teams.
What you'll do
- Work on HBM product design and support sustaining design maintenance (ECOs/spec changes).
- Own end-to-end debug of silicon, system, and customer issues, driving root-cause analysis and resolution.
- Collaborate with Design Engineering (DE), Product Engineering (PE), Technology Development (TD), and system teams to execute issue resolution.
- Identify and debug yield, reliability, and performance issues to improve product quality.
- Support customer bring-up, qualification, and system-level debug activities.
- Contribute learnings to improve design quality, debug efficiency, and verification methodologies.
What you'll need
- 4+ years (BS) or 2+ years (MS) in Electrical Engineering, Computer Engineering, or related field.
- Strong understanding of DRAM/HBM architecture and high-speed memory interfaces.
- Experience in digital and/or custom design and verification.
- Hands-on experience in silicon debug or post-silicon validation.
- Ability to independently drive complex technical issues to closure.
- Proficiency in Artificial Intelligence (Claude Code or similar) in improving design quality and efficiency.
Nice to have
- Experience with HBM/DDR/LPDDR or high-speed IO systems.
- Background in system-level debug and silicon-to-system correlation.
- Knowledge of timing and margin analysis, signal and power integrity.
- Experience with DFT / mBIST / test-mode debug.
- Programming/scripting skills (Python preferred) for debug automation.
Skills: HBM product design, silicon debug, DRAM/HBM architecture, high-speed memory interfaces, post-silicon validation
This role has been open 62 days — below the 65-day median for Memory Design roles.
Memory Design · Memory Design
|
Open roles in category
307
|
Median days open
65 d
|
Median salary
$186k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Micron Technology | All employers we track in this specialty (307 roles · 31 employers) |
|---|---|---|
| Open roles in this specialty | 154 | 307 |
| Median days open | 87 d | 65 d (+22 d vs this employer) |
| Median salary (USD postings) | — | $186k |
Skills observed across this category: HBM product design, silicon debug, DRAM/HBM architecture, high-speed memory interfaces, post-silicon validation
Who's hiring in this category
- Micron Technology (this employer) · 154 open roles · median 87 d
- Synopsys · 31 open roles · median 57 d
- Qualcomm · 19 open roles · median 78 d
- SanDisk · 17 open roles · median 44 d
- Broadcom · 16 open roles · median 58 d
- NVIDIA · 9 open roles · median 54 d
How we counted: 307 open Memory Design (Memory Design) roles from 31 employers tracked in the SemiconductorJobs index, counted 17 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.