Senior Product Development Engineer - Datacenter Boards

NPI product engineering role covering datacenter board ramp on GPU platforms like Blackwell and Vera Rubin.

Originally posted 3 June 2026 by the employer. Relisted by the employer on 31 October 2026.

About the role

This role drives module and board NPI for datacenter and HPC products from first-article through mass production ramp, taking accountability for yield targets, quality gates, and delivery. Technical work spans GPU platforms including Blackwell and Vera Rubin across silicon, PCB, and system layers.

What you'll do

• Drive module and board NPI for datacenter and HPC products from first-article through mass production ramp, meeting yield targets and quality gates.
• Define and continuously improve manufacturing test plans across board and system levels, partnering with worldwide contract manufacturing (CM) sites.
• Analyze volume manufacturing data with scripting and analytics tools to evaluate yield trends and guide operational decisions.
• Perform root-cause analysis on failing boards across silicon, PCB, and system layers to deliver DFM and DFT improvements.
• Brief leadership on program status, yield trends, and improvement roadmaps while enforcing engineering and quality standards with suppliers.

What you'll need

• Bachelor’s degree or Master's degree in Electrical Engineering, or equivalent experience.
• 5+ years of experience in product engineering, product development, manufacturing, or validation of PCBs, silicon, or complex systems.
• Hands-on depth in two or more areas: server architectures and datacenter system integration; PCB/board design, SMT, and assembly process engineering; board-level or post-silicon validation and characterization; high-speed interface validation (PCIe, NVLink, Ethernet, PAM4); Power Integrity analysis and thermal characterization; or complex test setup design and automation.
• Track record of taking complex GPU or board-level projects to mass production on schedule with yield and quality targets met.
• Understanding of testing strategy economics, including coverage, test-time, escape rate, yield, and cost.
• Willingness to travel up to 15% domestically and internationally.

Skills: Module and board NPI, datacenter and HPC products, volume manufacturing data, root-cause analysis, post-silicon validation

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