Senior Process Engineer - Plasma
Originally posted 24 November 2025 by the employer. Relisted by the employer on 27 October 2026.
Focus on plasma-based chambers, ICP/CCP/microwave plasma sources, and PECVD, PEALD, and RIE process mechanisms.
About the role
This role involves research and development in semiconductor manufacturing equipment, focusing on the development and improvement of plasma-based chambers.
What you'll do
- Conduct research and development of components and mechanisms, including concept creation, feasibility studies, and practical evaluation and testing. - Perform hardware characterization, define process windows, and analyze process-hardware interaction. - Design experiments, collect data, analyze results, and compile reports on process development experiments. - Develop new equipment and functionalities, as well as improve existing equipment, from specification to detailed design. - Work across multi-disciplined fields including process development, hardware development, and metrology.
What you'll need
- PhD in Physics, Engineering (Chemical, Electrical, Mechanical, or related fields), or Material Science, or a Master's degree with at least 3 years of professional experience. - In-depth knowledge of low-pressure RF plasma systems, including ICP, CCP, and microwave plasma sources. - Strong understanding of plasma-surface interactions and precursor/plasma chemistry. - Familiarity with PECVD, PEALD, and RIE process mechanisms. - Communication skills for technical documentation, cross-functional collaboration, and customer-facing discussions.
Nice to have
- Familiarity with epitaxial silicon growth and characterization. - Familiarity with EM and multi-physics simulation tools such as COMSOL, Ansys HFSS, or CST Studio. - Familiarity with plasma diagnostics, including Langmuir probes, OES, and VI probes. - Familiarity with thin-film and chemical characterization and metrology techniques, including SEM, TEM, XRD, Ellipsometry, XPS / AES, ICP-MS, particle analysis, and sheet resistance probe analysis.
Skills: low-pressure RF plasma systems, plasma-surface interactions, PECVD, PEALD, RIE
This role has been open 212 days — well above the 57-day median for Process Engineering roles.
Process Engineering · Etch Process
|
Open roles in category
69
|
Median days open
57 d
|
Median salary
—
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | ASM International | All employers we track in this specialty (69 roles · 19 employers) |
|---|---|---|
| Open roles in this specialty | 1 | 69 |
| Open roles in the wider Process, Fab & Equipment family | 262 | 10102 · 107 employers |
| Median days open | 212 d | 57 d (+155 d vs this employer) |
| Median salary (USD postings) | — | — |
Skills observed across this category: low-pressure RF plasma systems, plasma-surface interactions, PECVD, PEALD, RIE
Who's hiring in this category
- Micron Technology · 31 open roles · median 89 d
- STMicroelectronics · 7 open roles · median 36 d
- Texas Instruments · 4 open roles · median 56 d
- Tower Semiconductor · 4 open roles · median 56 d
- Applied Materials · 3 open roles · median 35 d
- Entegris · 2 open roles · median 63 d
How we counted: 69 open Process Engineering (Etch Process) roles from 19 employers tracked in the SemiconductorJobs index, counted 27 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.