Originally posted 31 August 2026 by the employer.
This role focuses on power module architectures for AI data center applications.
About the role
This role involves the electrical simulation of power modules for AI data center applications, focusing on new package and system integration.
What you'll do
- Perform power module, package, and system-level integration electrical simulation for AI data center power delivery applications.
- Model electrical-thermal-mechanical interaction for power modules, including SiC and GaN wide-bandgap devices, ISG chiplet, ASG, and 3D integration.
- Extract and analyze parasitic RLC of module layouts, busbars, interconnects, and packaging to minimize switching loss, overshoot, and EMI.
- Perform high-frequency simulation including S-parameter and power integrity/PDN analysis under fast AI compute load transients.
- Conduct electro-thermal co-simulation to predict junction temperatures, current sharing, and hotspots against reliability and derating targets.
- Analyze and correlate modeling results to measured data from power module hardware.
What you'll need
- PhD degree in Electrical Engineering, electrical simulation, or Physics with e-simulation (or Master's degree with 3 years' experience).
- Experience and skills in electrical modeling and simulation at the power module, package, and system level.
- Understanding of power semiconductor devices (SiC, GaN, silicon), switching dynamics, and power loss mechanisms.
- Knowledge and experience of CAD concepts and SolidWorks.
- Familiarity with semiconductor packaging, power module, and system integration.
- Familiarity with FEA software ANSYS HFSS, SIwave, Q3D, Maxwell, and ANSYS Electronics Desktop.
This role has been open 28 days — well below the 49-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
867
|
Median days open
49 d
|
Median salary
$159k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | onsemi | All employers we track in this specialty (867 roles · 103 employers) |
|---|---|---|
| Open roles in this specialty | 21 | 867 |
| Open roles in the wider Software, Firmware & Systems family | 34 | 5934 · 144 employers |
| Median days open | 57 d | 49 d (+8 d vs this employer) |
| Median salary (USD postings) | — | $159k |
Who's hiring in this category
- Intel Corporation · 59 open roles · median 21 d
- NVIDIA · 55 open roles · median 53 d
- KLA Corporation · 51 open roles · median 34 d
- Teradyne · 47 open roles · median 49 d
- AMD · 43 open roles · median 56 d
- Applied Materials · 42 open roles · median 65 d
How we counted: 867 open Hardware Systems Engineering (AI ML Hardware) roles from 103 employers tracked in the SemiconductorJobs index, counted 29 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.