Originally posted 28 August 2026 by the employer.
About the role
This role involves the fabrication and manufacturing processes for PCB and/or IC Substrates for RF product applications. The engineer will develop new substrate technologies from concept to high-volume manufacturing.
What you'll do
- Interface between the design community and suppliers to create technology roadmaps for future products.
- Develop, qualify, and support the clean launch of new PCB material sets, design rules, capabilities, and suppliers.
- Design material and surface finish evaluations using screening tests and design of experiments to improve product attributes.
- Utilize program management methodology to plan, execute, and monitor complex process and/or product development projects.
- Apply problem-solving skills and knowledge to solve challenges related to new technologies or improve existing supply chain capabilities.
- Travel to PCB suppliers to provide technical support for technology development, supplier qualification, and problem resolution.
What you'll need
- 5+ years of experience in PCB manufacturing or equivalent combination of advanced degree and education.
- Bachelor’s or higher degree in Chemistry or Engineering disciplines.
- Industry knowledge and experience with PCB manufacturing processes such as via drill, Cu pattern plating, panel plating, and surface finishes.
- Recognized understanding of IPC laminate/PCB standards.
- Experience in developing design rules.
- Ability to utilize SPC techniques, DOE, and structured problem-solving methodologies (e.g. DMAIC, 8D).
- Understanding of Design for Manufacturability and requirements for high-volume manufacturing.
- Experience with Altium, KiCAD, Cadence, or other PCB design software.
- Effective project management skills.
Nice to have
- Familiarity across a wide range of assembly/packaging process technologies and materials such as SMT, Die Attach, Wire Bond / Flip Chip, Molding, Multi-layer laminates.
This role has been open 26 days — well below the 47-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
831
|
Median days open
47 d
|
Median salary
$159k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | QORVO | All employers we track in this specialty (831 roles · 101 employers) |
|---|---|---|
| Open roles in this specialty | 11 | 831 |
| Open roles in the wider Software, Firmware & Systems family | 29 | 5931 · 143 employers |
| Median days open | 26 d | 47 d (−21 d vs this employer) |
| Median salary (USD postings) | — | $159k |
Who's hiring in this category
- Intel Corporation · 55 open roles · median 25 d
- NVIDIA · 54 open roles · median 51 d
- KLA Corporation · 48 open roles · median 39 d
- AMD · 45 open roles · median 50 d
- Applied Materials · 42 open roles · median 59 d
- Teradyne · 42 open roles · median 53 d
How we counted: 831 open Hardware Systems Engineering (AI ML Hardware) roles from 101 employers tracked in the SemiconductorJobs index, counted 23 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.