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QORVO

Senior PCB Fabrication Engineer - Richardson, TX, United States

QORVO Richardson, TX, US, 75081, United States 1 month ago
Digital Design & SoC Architecture

Originally posted 28 August 2026 by the employer.

About the role

This role involves overseeing PCB and/or IC Substrate manufacturing processes for RF product applications within Qorvo's RF Packaging Center of Excellence. The Senior PCB Fabrication Engineer will develop new substrate technologies for product requirements from concept to high volume manufacturing.

What you'll do

  • Interface between the design community and suppliers to create technology roadmaps for future products.
  • Develop, qualify, and support new PCB material sets, design rules, capabilities, and suppliers.
  • Design material and surface finish evaluations using screening tests and design of experiments.
  • Utilize program management methodology to plan, execute, and monitor process and product development projects.
  • Apply problem-solving skills and knowledge to address challenges related to new technologies or supply chain capabilities.
  • Provide technical support to PCB suppliers for technology development, qualification, and problem resolution.

What you'll need

  • 5+ years of experience in PCB manufacturing or an equivalent combination of advanced degree and education.
  • Bachelor's or higher degree in Chemistry or Engineering disciplines.
  • Industry knowledge and experience with PCB manufacturing processes, including via drill, Cu pattern plating, panel plating, and surface finishes.
  • Understanding of IPC laminate/PCB standards.
  • Experience in developing design rules.
  • Ability to utilize SPC techniques, DOE, and structured problem-solving methodologies (e.g., DMAIC, 8D).
  • Understanding of Design for Manufacturability and requirements for high-volume manufacturing.
  • Experience with Altium, KiCAD, Cadence, or other PCB design software.

Nice to have

  • Familiarity across assembly/packaging process technologies and materials such as SMT, Die Attach, Wire Bond / Flip Chip, Molding, and Multi-layer laminates.
Market context

This role has been open 30 days — well below the 48-day median for Hardware Systems Engineering roles.

Hardware Systems Engineering · AI ML Hardware

Open roles in category
847
Median days open
48 d
Median salary
$159k
See the full market breakdown ▾Category comparison, and who else is hiring
How QORVO compares in Hardware Systems Engineering hiring
Metric QORVO All employers we track in this specialty (847 roles · 102 employers)
Open roles in this specialty 9 847
Open roles in the wider Software, Firmware & Systems family 29 5855 · 143 employers
Median days open 28 d 48 d (−20 d vs this employer)
Median salary (USD postings) — $159k

Who's hiring in this category

  • Intel Corporation · 59 open roles · median 20 d
  • NVIDIA · 55 open roles · median 52 d
  • KLA Corporation · 50 open roles · median 42 d
  • Teradyne · 44 open roles · median 50 d
  • AMD · 43 open roles · median 55 d
  • Applied Materials · 41 open roles · median 67 d

How we counted: 847 open Hardware Systems Engineering (AI ML Hardware) roles from 102 employers tracked in the SemiconductorJobs index, counted 28 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.

Apply now
Richardson, TX, US, 75081, United States
On-site
1 month ago

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