Originally posted 28 August 2026 by the employer.
About the role
This role involves overseeing PCB and/or IC substrate manufacturing processes for RF product applications at Qorvo. You will contribute to packaging innovation for the RF market by developing new substrate technologies.
What you'll do
- Interface between the design community and worldwide supply base to create technology roadmaps.
- Develop, qualify, and support the launch of new PCB material sets, design rules, capabilities, and suppliers.
- Design material and surface finish evaluations using screening tests and design of experiments.
- Utilize program management methodology to plan, execute, and monitor complex process and/or product development projects.
- Apply problem-solving skills to address challenges related to new technologies or improve supply chain capabilities.
- Provide technical support to PCB suppliers for technology development, supplier qualification, and problem resolution.
What you'll need
- 5+ years of experience in PCB manufacturing or an equivalent combination of advanced degree and education.
- Bachelor's or higher degree in Chemistry or Engineering disciplines.
- Industry knowledge and experience with PCB manufacturing processes (e.g., via drill, Cu pattern plating, panel plating, surface finishes).
- Recognized understanding of IPC laminate/PCB standards.
- Experience in developing design rules.
- Ability to utilize SPC techniques, DOE, and structured problem-solving methodologies (e.g., DMAIC, 8D).
- Understanding of Design for Manufacturability and requirements for ramping technologies in a high-volume manufacturing environment.
- Experience with Altium, KiCAD, Cadence, or other PCB design software.
- Effective project management skills.
Nice to have
- Familiarity across a wide range of assembly/packaging process technologies and materials such as SMT, Die Attach, Wire Bond / Flip Chip, Molding, Multi-layer laminates.
This role has been open 32 days — well below the 48-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
881
|
Median days open
48 d
|
Median salary
$159k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | QORVO | All employers we track in this specialty (881 roles · 103 employers) |
|---|---|---|
| Open roles in this specialty | 9 | 881 |
| Open roles in the wider Software, Firmware & Systems family | 27 | 5943 · 145 employers |
| Median days open | 30 d | 48 d (−18 d vs this employer) |
| Median salary (USD postings) | — | $159k |
Who's hiring in this category
- Intel Corporation · 63 open roles · median 27 d
- NVIDIA · 56 open roles · median 54 d
- KLA Corporation · 51 open roles · median 34 d
- Teradyne · 48 open roles · median 31 d
- AMD · 41 open roles · median 57 d
- Applied Materials · 41 open roles · median 63 d
How we counted: 881 open Hardware Systems Engineering (AI ML Hardware) roles from 103 employers tracked in the SemiconductorJobs index, counted 30 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.