Senior Package Modeling Engineer - CA, Santa Clara, United States

Originally posted 19 August 2026 by the employer. Relisted by the employer on 11 September 2026.

Model thermo-mechanical behavior and warpage across CoWoS-R, CoWoS-L, and 2.5D/3D IC packaging architectures.

About the role

NVIDIA is seeking a Senior Package Modeling Engineer in the Advanced Technology Group (ATG) to assess reliability and performance across advanced semiconductor package developments.

What you'll do

• Conduct Finite Element Analysis (FEA) to assess stress, warpage, and thermo-mechanical behavior throughout advanced semiconductor packaging platforms.
• Evaluate new materials, interconnect concepts, and process options focused on structural robustness and reliability.
• Analyze material properties and evaluate their impact on package reliability.
• Establish modeling approaches and assumptions, interpret simulation results, and provide mentorship influencing package build, material selection, and manufacturing processes.
• Collaborate with cross-functional teams to ensure robust package builds.
• Document modeling methodologies and present findings to collaborators.

What you'll need

• MS or PhD or equivalent experience in Mechanical Engineering, Materials Science, or related field.
• 5+ years of FEA modeling/simulation experience.
• Expertise in FEA tools (ANSYS, Abaqus, COMSOL, or equivalent).
• Knowledge of thermal-mechanical interactions and reliability failure modes.
• Practical understanding of advanced semiconductor packaging architecture and materials (flip-chip, 2.5D/3D IC, CoWoS-R, CoWoS-L, advanced substrates).

Skills: Finite Element Analysis, FEA, stress analysis, warpage, thermo-mechanical, 2.5D/3D IC, CoWoS